CAMM (memory module)

Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMM and SO-DIMM which use edge connectors and had been in use for about 25 years. The first SODIMMs were introduced by JEDEC in 1997.

CAMM was created to overcome technical limitations of traditional slotted DIMM. The CAMM module allows for shorter traces as compared to SO-DIMM, allowing the memory to be run with less power and at higher speeds. The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard.

Advantages of CAMM include lower thickness, allows for replaceable LPDDR modules, provide faster speeds above 6400 MHz, more capacities up to 128 GB per module and higher bandwidth. Disadvantages are that it cannot be mounted without tools and uses six screws.

The total number of interface contact points of CAMM is 616 (44 per row times 14 rows).

History
In April 2022, Dell launched laptops in the Dell Precision 7000-series that used a custom form factor of CAMM for DDR5 SDRAM.

In June 2023, ADATA demoed an updated design CAMM memory module, which looks different (and more compact) than Dell's 2022 design.

The Compression Attached Memory Module specification was finalised and published by JEDEC as CAMM2 on December 5, 2023.

The first computer, and laptop, to use CAMM2 memory modules is the Lenovo ThinkPad P1 Gen 7 released in April 2024.

In May 2024, MSI announced the first desktop consumer motherboard with CAMM2 support, the Z790 Project Zero Plus.