Draft:European Semiconductor Manufacturing Company

The European Semiconductor Manufacturing Company (ESMC) is a planned joint venture between Taiwan Semiconductor Manufacturing Company (TSMC) and multiple European semiconductor companies. The production site will be built in the north of Dresden between Q4 2024 and 2027.

Project
The joint venture consists of TSMC (70 %) as the namesake and the European companies Infineon, NXP and Bosch (10 % respectively). The production facility will be built near the Airportpark industrial estate, where Bosch already manufactures microchips. Half of the investment, which is projected at 11 billion euros, is expected to be covered by the German state. Another portion will be subsidized by the European Union in accordance with the European Chips Act (ECA). The project is expected to create 2000 new jobs. TU Dresden, National Taiwan University and TSMC are cooperating on a training programme for German chip engineers ahead of the spike in demand.

ESMC will initially be a 300 millimetre factory producing chips in the 12 to 28 nanometre range with a monthly capacity of 40,000 wafers. Microchips will primarily be produced for the automotive sector and other industrial domains.