IEEE Rao R. Tummala Electronics Packaging Award

The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients
Recipients of the award for each year include:


 * 2021: Chin C. Lee
 * 2020: Mitsumasa Koyanagi and Peter Ramm
 * 2019: Ephraim Suhir
 * 2018: William Chen
 * 2017: Paul S. Ho and King-Ning Tu
 * 2016: Michael Pecht
 * 2015: Nasser Borozorg-Grayeli
 * 2014: Avram Bar-Cohen
 * 2013: John Lau
 * 2012: Mauro Walker
 * 2011: Rao R. Tummala
 * 2010: Herbert Reichl
 * 2009:	George G. Harman


 * 2008:	Karl Puttlitz and Paul A. Totta
 * 2007: Dimitry Grabbe
 * 2006: C. P. Wong
 * 2005: Yutaka Tsukada
 * 2004: John W. Balde