List of AMD processors with 3D graphics

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

Lynx: "Llano" (2011)

 * Socket FM1
 * CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
 * L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
 * L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
 * MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
 * GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.
 * List of embedded GPU's
 * Support for up to four DIMMs of up to DDR3-1866 memory
 * Fabrication 32 nm on GlobalFoundries SOI process; Die size: $228 mm2$, with 1.178 billion transistors
 * 5 GT/s UMI
 * Integrated PCIe 2.0 controller
 * Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
 * Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Virgo: "Trinity" (2012)

 * Fabrication 32 nm on GlobalFoundries SOI process
 * Socket FM2
 * CPU: Piledriver
 * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
 * GPU TeraScale 3 (VLIW4)
 * Die Size: $246 mm2$, 1.303 Billion transistors
 * Support for up to four DIMMs of up to DDR3-1866 memory
 * 5 GT/s UMI
 * GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
 * Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
 * Sempron and Athlon models exclude integrated graphics
 * Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.

"Richland" (2013)

 * Fabrication 32 nm on GlobalFoundries SOI process
 * Socket FM2
 * Two or four CPU cores based on the Piledriver microarchitecture
 * Die Size: $246 mm2$, 1.303 Billion transistors
 * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
 * GPU
 * TeraScale 3 architecture
 * HD Media Accelerator, AMD Hybrid Graphics

"Kabini" (2013, SoC)

 * Fabrication 28 nm by GlobalFoundries
 * Socket AM1, aka Socket FS1b (AM1 platform)
 * 2 to 4 CPU Cores (Jaguar (microarchitecture))
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
 * GPU based on Graphics Core Next (GCN)

"Kaveri" (2014) & "Godavari" (2015)

 * Fabrication 28 nm by GlobalFoundries.
 * Socket FM2+, support for PCIe 3.0.
 * Two or four CPU cores based on the Steamroller microarchitecture.
 * Kaveri refresh models have codename Godavari.
 * Die Size: $245 mm2$, 2.41 Billion transistors.
 * L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
 * Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs).
 * Heterogeneous System Architecture-enabled zero-copy through pointer passing.
 * SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.
 * Dual-channel (2× 64 Bit) DDR3 memory controller.
 * Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models.
 * Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
 * Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.

"Carrizo" (2016)

 * Fabrication: 28 nm by GlobalFoundries
 * Socket FM2+ or AM4, support for PCIe 3.0
 * Two or four CPU cores based on the Excavator microarchitecture
 * Die size: $250.04 mm2$, 3.1 billion transistors
 * L1 cache: 32 KB data per core and 96 KB instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
 * Single- or dual-channel DDR3 or DDR4 memory controller
 * Third generation GCN-based GPU (Radeon M300)
 * Integrated custom ARM Cortex-A5 coprocessor with TrustZone security extensions

"Bristol Ridge" (2016)

 * Fabrication 28 nm by GlobalFoundries
 * Socket AM4, support for PCIe 3.0
 * Two or four "Excavator+" CPU cores
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
 * Dual-channel DDR4 memory controller
 * PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
 * PCI Express 3.0 x4 as link to optional external chipset
 * 4x USB 3.1 Gen 1
 * Storage: 2x SATA and 2x NVMe or 2x PCI Express
 * Third Generation GCN based GPU with hybrid VP9 decoding

"Raven Ridge" (2018)

 * Fabrication 14 nm by GlobalFoundries
 * Transistors: 4.94 billion
 * Die size: 210 mm²
 * Socket AM4
 * Zen CPU cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual-channel DDR4 memory controller
 * Fifth generation GCN based GPU
 * Video Core Next (VCN) 1.0

"Picasso" (2019)

 * Fabrication 12 nm by GlobalFoundries
 * Transistors: 4.94 billion
 * Die size: 210 mm²
 * Socket AM4
 * Zen+ CPU cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual-channel DDR4 memory controller
 * Fifth generation GCN based GPU
 * Video Core Next (VCN) 1.0

"Renoir" (2020)

 * Fabrication 7 nm by TSMC
 * Socket AM4
 * Up to eight Zen 2 CPU cores
 * Dual-channel DDR4 memory controller

"Cezanne" (2021)

 * Fabrication 7 nm by TSMC
 * Socket AM4
 * Up to eight Zen 3 CPU cores
 * Dual-channel DDR4 memory controller

"Raphael" (2022)

 * Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
 * Socket AM5
 * Up to sixteen Zen 4 CPU cores
 * Dual-channel DDR5 memory controller


 * Basic iGPU

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)

 * Fabrication 28 nm
 * Socket FT3 (BGA)
 * 4 CPU Cores (Jaguar & Puma microarchitecture)
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * Single-channel DDR3 memory controller
 * Turbo Dock Technology, C6 and CC6 low power states
 * GPU based on 2nd generation Graphics Core Next (GCN) architecture

Opteron X3000-series "Toronto" (2017)

 * Fabrication 28 nm
 * Socket FP4 (BGA)
 * Two or Four CPU cores based on the Excavator microarchitecture
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
 * Dual-channel DDR4 memory controller
 * GPU based on 3rd generation Graphics Core Next (GCN) architecture

Sabine: "Llano" (2011)

 * Fabrication 32 nm on GlobalFoundries SOI process
 * Socket FS1
 * Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
 * L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
 * Integrated PCIe 2.0 controller
 * GPU: TeraScale 2
 * Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
 * Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
 * 2.5 GT/s UMI
 * MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
 * PowerNow!

Comal: "Trinity" (2012)

 * Fabrication 32 nm on GlobalFoundries SOI process
 * Socket FS1r2, FP2
 * Based on the Piledriver architecture
 * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
 * GPU: TeraScale 3 (VLIW4)
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
 * Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
 * 2.5 GT/s UMI
 * Transistors: 1.303 billion
 * Die size: 246 mm²

"Richland" (2013)

 * Fabrication 32 nm on GlobalFoundries SOI process
 * Socket FS1r2, FP2
 * Elite Performance APU.
 * CPU: Piledriver architecture
 * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
 * GPU: TeraScale 3 (VLIW4)
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

"Kaveri" (2014)

 * Fabrication 28 nm
 * Socket FP3
 * Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.
 * L1 Cache: 16 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
 * Three to eight Compute Units (CUs) based on Graphics Core Next (GCN) microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
 * AMD Heterogeneous System Architecture (HSA) 2.0
 * SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio
 * Dual-channel (2x64-bit) DDR3 memory controller
 * Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions

"Carrizo" (2015)

 * Fabrication 28 nm
 * Socket FP4
 * Up to 4 Excavator x86 CPU cores
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
 * GPU based on Graphics Core Next 1.2

"Bristol Ridge" (2016)

 * Fabrication 28 nm
 * Socket FP4
 * Two or four "Excavator+" x86 CPU cores
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
 * GPU based on Graphics Core Next 1.2 with VP9 decoding

"Raven Ridge" (2017)

 * Fabrication 14 nm by GlobalFoundries
 * Transistors: 4.94 billion
 * Socket FP5
 * Die size: 210 mm²
 * Zen CPU cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Fifth generation GCN-based GPU

"Picasso" (2019)

 * Fabrication 12 nm by GlobalFoundries
 * Socket FP5
 * Die size: 210 mm²
 * Up to four Zen+ CPU cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual-channel DDR4 memory controller
 * Fifth generation GCN-based GPU

"Renoir" (2020)

 * Fabrication 7 nm by TSMC
 * Socket FP6
 * Die size: 156 mm²
 * 9.8 billion transistors on one single 7 nm monolithic die
 * Up to eight Zen 2 CPU cores
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * Fifth generation GCN-based GPU
 * Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
 * All the CPUs support 16 PCIe 3.0 lanes.

"Lucienne" (2021)

 * Fabrication 7 nm by TSMC
 * Socket FP6
 * Die size: 156 mm²
 * 9.8 billion transistors on one single 7 nm monolithic die
 * Up to eight Zen 2 CPU cores
 * Fifth generation GCN-based GPU (7 nm Vega)

"Cezanne" (2021)

 * Fabrication 7 nm by TSMC
 * Socket FP6
 * Die size: 180 mm²
 * Up to eight Zen 3 CPU cores
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * Fifth generation GCN-based GPU
 * Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
 * All the CPUs support 16 PCIe 3.0 lanes.

"Barceló" (2022)

 * Fabrication 7 nm by TSMC
 * Socket FP6
 * Die size: 180 mm²
 * Up to eight Zen 3 CPU cores
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * Fifth generation GCN-based GPU
 * Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
 * All the CPUs support 16 PCIe 3.0 lanes.

"Rembrandt" (2022)

 * Fabrication 6 nm by TSMC
 * Socket FP7
 * Die size: 210 mm²
 * Up to eight Zen 3+ CPU cores
 * Second generation RDNA-based GPU

"Phoenix" (2023)

 * Fabrication 4 nm by TSMC
 * Up to eight Zen 4 CPU cores
 * Dual-channel DDR5 or LPDDR5x memory controller
 * RDNA3 iGPU
 * XDNA accelerator

"Dragon Range" (2023)

 * Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
 * Up to sixteen Zen 4 CPU cores
 * Dual-channel DDR5 memory controller
 * Basic RDNA2 iGPU

Brazos: "Desna", "Ontario", "Zacate" (2011)

 * Fabrication 40 nm by TSMC
 * Socket FT1 (BGA-413)
 * Based on the Bobcat microarchitecture
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
 * PowerNow!
 * DirectX 11 integrated graphics with UVD 3.0
 * Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
 * 2.50 GT/s UMI (PCIe 1.0 ×4)

Brazos 2.0: "Ontario", "Zacate" (2012)

 * Fabrication 40 nm by TSMC
 * Socket FT1 (BGA-413)
 * Based on the Bobcat microarchitecture
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
 * PowerNow!
 * DirectX 11 integrated graphics
 * C-series denote Ontario; and the E-series denotes Zacate
 * 2.50 GT/s UMI (PCIe 1.0 ×4)

Brazos-T: "Hondo" (2012)

 * Fabrication 40 nm by TSMC
 * Socket FT1 (BGA-413)
 * Based on the Bobcat microarchitecture
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * Found in tablet computers
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
 * PowerNow!
 * DirectX 11 integrated graphics
 * 2.50 GT/s UMI (PCIe 1.0 ×4)

"Kabini", "Temash" (2013)

 * Fabrication 28 nm by TSMC
 * Socket FT3 (BGA)
 * 2 to 4 CPU Cores (Jaguar (microarchitecture))
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * Turbo Dock Technology, C6 and CC6 low power states
 * GPU based on Graphics Core Next (GCN)
 * AMD Eyefinity multi-monitor for up to two displays

"Beema", "Mullins" (2014)

 * Fabrication 28 nm by GlobalFoundries
 * Socket FT3b (BGA)
 * CPU: 2 to 4 (Puma cores)
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * GPU based on Graphics Core Next (GCN)
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * Intelligent Turbo Boost
 * Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

"Carrizo-L" (2015)

 * Fabrication 28 nm by GlobalFoundries
 * Socket FT3b (BGA), FP4 (μBGA)
 * CPU: 2 to 4 (Puma+ cores)
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * GPU based on Graphics Core Next (GCN)
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * Intelligent Turbo Boost
 * Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
 * All models except A8-7410 available in both laptop and all-in-one desktop versions

"Stoney Ridge" (2016)

 * Fabrication 28 nm by GlobalFoundries
 * Socket FP4 / FT4
 * 2 "Excavator+" x86 CPU cores
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * Single-channel DDR4 memory controller
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
 * GPU based on Graphics Core Next 3rd Generation with VP9 decoding

"Dalí" (2020)

 * Fabrication 14 nm by GlobalFoundries
 * Socket FP5
 * Two Zen CPU cores
 * Over 30% die size reduction over predecessor (Raven Ridge)
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual-channel RAM

"Pollock" (2020)

 * Fabrication 14 nm by GlobalFoundries
 * Socket FT5
 * Two Zen CPU cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Single-channel RAM

Brazos: "Ontario" and "Zacate" (2011)

 * Fabrication 40 nm
 * Socket FT1 (BGA-413)
 * CPU microarchitecture: Bobcat
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
 * GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
 * Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
 * 5 GT/s UMI

"Kabini" (2013, SoC)

 * Fabrication 28 nm
 * Socket FT3 (769-BGA)
 * CPU microarchitecture: Jaguar
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module (TPM) 1.2 support
 * GPU microarchitecture: Graphics Core Next (GCN) with Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.)
 * Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
 * Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0 (except GX-210JA)

"Steppe Eagle" (2014, SoC)

 * Fabrication 28 nm
 * Socket FT3b (769-BGA)
 * CPU microarchitecture: Puma
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

"Crowned Eagle" (2014, SoC)

 * Fabrication 28 nm
 * Socket FT3b (769-BGA)
 * CPU microarchitecture: Puma
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * no GPU

LX-Family (2016, SoC)

 * Fabrication 28 nm
 * Socket FT3b (769-BGA)
 * 2 Puma x86 cores with 1MB shared L2 cache
 * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
 * GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
 * Single channel 64-bit DDR3 memory with ECC
 * Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

I-Family: "Brown Falcon" (2016, SoC)

 * Fabrication 28 nm
 * Socket FP4
 * 2 or 4 Excavator x86 cores with 1MB shared L2 cache
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
 * GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
 * Dual channel 64-bit DDR4 or DDR3 memory with ECC
 * 4K × 2K H.265 decode capability and multi format encode and decode
 * Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

J-Family: "Prairie Falcon" (2016, SoC)

 * Fabrication 28 nm
 * Socket FP4
 * 2 "Excavator+" x86 cores with 1MB shared L2 cache
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
 * GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
 * Single channel 64-bit DDR4 or DDR3 memory
 * 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
 * Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Comal: "Trinity" (2012)

 * Fabrication 32 nm
 * Socket FP2 (BGA-827), FS1r2
 * CPU microarchitecture: Piledriver
 * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
 * GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
 * Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
 * 2.5 GT/s UMI
 * Die size: 246 mm²; Transistors: 1.303 billion
 * OpenCL 1.1 and OpenGL 4.2 support

"Bald Eagle" (2014)

 * Fabrication 28 nm
 * Socket FP3
 * Up to 4 Steamroller x86 cores
 * L1 Cache: 16 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
 * GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
 * Dual channel DDR3 memory with ECC
 * Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

"Merlin Falcon" (2015, SoC)

 * Fabrication 28 nm
 * Socket FP4
 * Up to 4 Excavator x86 cores
 * L1 Cache: 32 KB Data per core and 96 KB Instructions per module
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
 * GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
 * Dual channel 64-bit DDR4 or DDR3 memory with ECC
 * Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
 * Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
 * Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

V1000-Family: "Great Horned Owl" (2018, SoC)

 * Fabrication 14 nm by GlobalFoundries
 * Up to 4 Zen cores
 * Socket FP5
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual channel DDR4 memory with ECC
 * Fifth generation GCN based GPU

R1000-Family: "Banded Kestrel" (2019, SoC)

 * Fabrication 14 nm by GlobalFoundries
 * Up to 2 Zen cores
 * Socket FP5
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
 * Dual channel DDR4 memory with ECC
 * Fifth generation GCN based GPU

V2000-Family: "Grey Hawk" (2020, SoC)

 * Fabrication 7 nm by TSMC
 * Up to 8 Zen 2 cores
 * Fifth generation GCN based GPU

R2000-Family: "River Hawk" (2022, SoC)

 * Fabrication 12 nm by GlobalFoundries
 * Up to 4 Zen+ cores
 * MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

Custom APUs
As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit. Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One. So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.