List of semiconductor scale examples

Listed are many semiconductor scale examples for various metal–oxide–semiconductor field-effect transistor (MOSFET, or MOS transistor) semiconductor manufacturing process nodes.

Timeline of MOSFET demonstrations


Products featuring 20 μm manufacturing process

 * RCA's CD4000 series of integrated circuits (ICs) beginning in 1968.

Products featuring 10 μm manufacturing process

 * Intel 4004, the first single-chip microprocessor CPU, launched in 1971.
 * Intel 8008 CPU launched in 1972.
 * MOS Technology 6502 1 MHz CPU launched in 1975 (8 μm).

Products featuring 8 μm manufacturing process

 * Intel 1103, an early dynamic random-access memory (DRAM) chip launched in 1970.

Products featuring 6 μm manufacturing process

 * Toshiba TLCS-12, a microprocessor developed for the Ford EEC (Electronic Engine Control) system in 1973.
 * Intel 8080 CPU launched in 1974 was manufactured using this process.
 * The Television Interface Adaptor, the custom graphics and audio chip developed for the Atari 2600 in 1977.
 * MOS Technology SID, a programmable sound generator developed for the Commodore 64 in 1982.
 * MOS Technology VIC-II, a video display controller developed for the Commodore 64 in 1982 (5 μm).

Products featuring 3 μm manufacturing process

 * Intel 8085 CPU launched in 1976.
 * Intel 8086 CPU launched in 1978.
 * Intel 8088 CPU launched in 1979.
 * Motorola 68000 8 MHz CPU launched in 1979 (3.5 μm).

Products featuring 1.5 μm manufacturing process

 * NEC's 64kb SRAM memory chip in 1981.
 * Intel 80286 CPU launched in 1982.
 * The Amiga Advanced Graphics Architecture (initially sold in 1992) included chips such as Denise that were manufactured using a 1.5 μm CMOS process.

Products featuring 1 μm manufacturing process

 * NTT's DRAM memory chips, including its 64kb chip in 1979 and 256kb chip in 1980.
 * NEC's 1Mb DRAM memory chip in 1984.
 * Intel 80386 CPU launched in 1985.

Products featuring 800 nm manufacturing process

 * NTT's 1Mb DRAM memory chip in 1984.
 * NEC and Toshiba used this process for their 4Mb DRAM memory chips in 1986.
 * Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4Mb DRAM memory chips in 1987.
 * Toshiba's 4Mb EPROM memory chip in 1987.
 * Hitachi, Mitsubishi and Toshiba used this process for their 1Mb SRAM memory chips in 1987.
 * Intel 486 CPU launched in 1989.
 * microSPARC I launched in 1992.
 * First Intel P5 Pentium CPUs at 60 MHz and 66 MHz launched in 1993.

Products featuring 600 nm manufacturing process

 * Mitsubishi Electric, Toshiba and NEC introduced 16Mb DRAM memory chips manufactured with a 600nm process in 1989.
 * NEC's 16Mb EPROM memory chip in 1990.
 * Mitsubishi's 16Mb flash memory chip in 1991.
 * Intel 80486DX4 CPU launched in 1994.
 * IBM/Motorola PowerPC 601, the first PowerPC chip, was produced in 0.6 μm.
 * Intel Pentium CPUs at 75 MHz, 90 MHz and 100 MHz.

Products featuring 350 nm manufacturing process

 * Sony's 16Mb SRAM memory chip in 1994.
 * NEC VR4300 (1995), used in the Nintendo 64 game console.
 * Intel Pentium Pro (1995), Pentium (P54CS, 1995), and initial Pentium II CPUs (Klamath, 1997).
 * AMD K5 (1996) and original AMD K6 (Model 6, 1997) CPUs.
 * Parallax Propeller, 8 core microcontroller.

Products featuring 250 nm manufacturing process

 * Hitachi's 16Mb SRAM memory chip in 1993.
 * Hitachi and NEC introduced 256Mb DRAM memory chips manufactured with this process in 1993, followed by Matsushita, Mitsubishi Electric and Oki in 1994.
 * NEC's 1Gb DRAM memory chip in 1995.
 * Hitachi's 128Mb NAND flash memory chip in 1996.
 * DEC Alpha 21264A, which was made commercially available in 1999.
 * AMD K6-2 Chomper and Chomper Extended. Chomper was released on May 28, 1998.
 * AMD K6-III "Sharptooth" used 250 nm.
 * Mobile Pentium MMX Tillamook, released in August 1997.
 * Pentium II Deschutes.
 * Dreamcast console's Hitachi SH-4 CPU and PowerVR2 GPU, released in 1998.
 * Pentium III Katmai.
 * Initial PlayStation 2's Emotion Engine CPU.

Processors using 180 nm manufacturing technology

 * Intel Coppermine E- October 1999
 * Sony PlayStation 2 console's Emotion Engine and Graphics Synthesizer – March 2000
 * ATI Radeon R100 and RV100 Radeon 7000 – 2000
 * AMD Athlon Thunderbird – June 2000
 * Intel Celeron (Willamette) – May 2002
 * Motorola PowerPC 7445 and 7455 (Apollo 6) – January 2002

Processors using 130 nm manufacturing technology

 * Fujitsu SPARC64 V – 2001
 * Gekko by IBM and Nintendo (GameCube console) – 2001
 * Motorola PowerPC 7447 and 7457 – 2002
 * IBM PowerPC G5 970 – October 2002 – June 2003
 * Intel Pentium III Tualatin and Coppermine – 2001-04
 * Intel Celeron Tualatin-256 – 2001-10-02
 * Intel Pentium M Banias – 2003-03-12
 * Intel Pentium 4 Northwood- 2002-01-07
 * Intel Celeron Northwood-128 – 2002-09-18
 * Intel Xeon Prestonia and Gallatin – 2002-02-25
 * VIA C3 – 2001
 * AMD Athlon XP Thoroughbred, Thorton, and Barton
 * AMD Athlon MP Thoroughbred – 2002-08-27
 * AMD Athlon XP-M Thoroughbred, Barton, and Dublin
 * AMD Duron Applebred – 2003-08-21
 * AMD K7 Sempron Thoroughbred-B, Thorton, and Barton – 2004-07-28
 * AMD K8 Sempron Paris – 2004-07-28
 * AMD Athlon 64 Clawhammer and Newcastle – 2003-09-23
 * AMD Opteron Sledgehammer – 2003-06-30
 * Elbrus 2000 1891ВМ4Я (1891VM4YA) – 2008-04-27
 * MCST-R500S 1891BM3 – 2008-07-27
 * Vortex 86SX –

Chips using 90 nm manufacturing technology

 * Sony–Toshiba Emotion Engine+Graphics Synthesizer (PlayStation 2) – 2003
 * IBM PowerPC G5 970FX – 2004
 * Elpida Memory's 90 nm DDR2 SDRAM process – 2005
 * IBM PowerPC G5 970MP – 2005
 * IBM PowerPC G5 970GX – 2005
 * IBM Waternoose Xbox 360 Processor – 2005
 * IBM–Sony–Toshiba Cell processor – 2005
 * Intel Pentium 4 Prescott – 2004-02
 * Intel Celeron D Prescott-256 – 2004-05
 * Intel Pentium M Dothan – 2004-05
 * Intel Celeron M Dothan-1024 – 2004-08
 * Intel Xeon Nocona, Irwindale, Cranford, Potomac, Paxville – 2004-06
 * Intel Pentium D Smithfield – 2005-05
 * AMD Athlon 64 Winchester, Venice, San Diego, Orleans – 2004-10
 * AMD Athlon 64 X2 Manchester, Toledo, Windsor – 2005-05
 * AMD Sempron Palermo and Manila – 2004-08
 * AMD Turion 64 Lancaster and Richmond – 2005-03
 * AMD Turion 64 X2 Taylor and Trinidad – 2006-05
 * AMD Opteron Venus, Troy, and Athens – 2005-08
 * AMD Dual-core Opteron Denmark, Italy, Egypt, Santa Ana, and Santa Rosa
 * VIA C7 – 2005-05
 * Loongson (Godson) 2Е STLS2E02 – 2007-04
 * Loongson (Godson) 2F STLS2F02 – 2008-07
 * MCST-4R – 2010-12
 * Elbrus-2C+ – 2011-11

Processors using 65 nm manufacturing technology

 * Sony–Toshiba EE+GS (PStwo) – 2005
 * Intel Pentium 4 (Cedar Mill) – 2006-01-16
 * Intel Pentium D 900-series – 2006-01-16
 * Intel Celeron D (Cedar Mill cores) – 2006-05-28
 * Intel Core – 2006-01-05
 * Intel Core 2 – 2006-07-27
 * Intel Xeon (Sossaman) – 2006-03-14
 * AMD Athlon 64 series (starting from Lima) – 2007-02-20
 * AMD Turion 64 X2 series (starting from Tyler) – 2007-05-07
 * AMD Phenom series
 * IBM's Cell Processor – PlayStation 3 – 2007-11-17
 * IBM's z10
 * Microsoft Xbox 360 "Falcon" CPU – 2007–09
 * Microsoft Xbox 360 "Opus" CPU – 2008
 * Microsoft Xbox 360 "Jasper" CPU – 2008–10
 * Microsoft Xbox 360 "Jasper" GPU – 2008–10
 * Sun UltraSPARC T2 – 2007–10
 * AMD Turion Ultra – 2008-06
 * TI OMAP 3 Family – 2008-02
 * VIA Nano – 2008-05
 * Loongson – 2009
 * NVIDIA GeForce 8800GT GPU – 2007

Processors using 45 nm technology

 * Matsushita released the 45 nm Uniphier in 2007.
 * Wolfdale, Yorkfield, Yorkfield XE and Penryn are Intel cores sold under the Core 2 brand.
 * Intel Core i7 series processors, i5 750 (Lynnfield and Clarksfield)
 * Pentium Dual-Core Wolfdale-3M are current Intel mainstream dual core sold under the Pentium brand.
 * Diamondville, Pineview are current Intel cores with hyper-threading sold under the Intel Atom brand.
 * AMD Deneb (Phenom II) and Shanghai (Opteron) Quad-Core Processors, Regor (Athlon II) dual core processors, Caspian (Turion II) mobile dual core processors.
 * AMD (Phenom II) "Thuban" Six-Core Processor (1055T)
 * Xenon in the Xbox 360 S model.
 * Sony–Toshiba Cell Broadband Engine in PlayStation 3 Slim model – September 2009.
 * Samsung S5PC110, as known as Hummingbird.
 * Texas Instruments OMAP 36xx.
 * IBM POWER7 and z196
 * Fujitsu SPARC64 VIIIfx series
 * Espresso (microprocessor) Wii U CPU

Chips using 32 nm technology

 * Toshiba produced commercial 32Gb NAND flash memory chips with the 32nm process in 2009.
 * Intel Core i3 and i5 processors, released in January 2010
 * Intel 6-core processor, codenamed Gulftown
 * Intel i7-970, was released in late July 2010, priced at approximately US$900
 * AMD FX Series processors, codenamed Zambezi and based on AMD's Bulldozer architecture, were released in October 2011. The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design.
 * Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011

Chips using 24–28 nm technology

 * SK Hynix announced that it could produce a 26 nm flash chip with 64 Gb capacity; Intel Corp. and Micron Technology had by then already developed the technology themselves. Announced in 2010.
 * Toshiba announced that it was shipping 24 nm flash memory NAND devices on August 31, 2010.
 * In 2016 MCST's 28 nm processor Elbrus-8S went for serial production.

Chips using 22 nm technology

 * Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22 nm technology for series 7 chip-sets went on sale worldwide on April 23, 2012.

Chips using 20 nm technology

 * Samsung Electronics began mass production of 64Gb NAND flash memory chips using a 20 nm process in 2010.
 * Nvidia Tegra X1 (Nintendo Switch and Nvidia Shield TV)

Chips using 16 nm technology

 * TSMC first began 16nm FinFET chip production in 2013.
 * Nvidia Tegra X1+ (later Nintendo Switch and Nvidia Shield TV models)

Chips using 14 nm technology

 * Intel Core i7 and Intel Core i5 processors based on Intel's Broadwell 14 nm technology was launched in January 2015.
 * AMD Ryzen processors based on AMD's Zen or Zen+ architectures and which uses 14 nm FinFET technology.

Chips using 10 nm technology

 * Samsung announced that it had begun mass production of multi-level cell (MLC) flash memory chips using a 10nm process in 2013. On 17 October 2016, Samsung Electronics announced mass production of SoC chips at 10 nm.
 * TSMC began commercial production of 10 nm chips in early 2016, before moving onto mass production in early 2017.
 * Samsung began shipping Galaxy S8 smartphone in April 2017 using the company's 10 nm processor.
 * Apple delivered second-generation iPad Pro tablets powered with TSMC-produced Apple A10X chips using the 10 nm FinFET process in June 2017.

Chips using 7 nm technology

 * TSMC began risk production of 256 Mbit SRAM memory chips using a 7 nm process in April 2017.
 * Samsung and TSMC began mass production of 7 nm devices in 2018.
 * Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC.
 * AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, with Zen 2-based CPUs and APUs from July 2019, and for both PlayStation 5 and Xbox Series X/S consoles' APUs, released both in November 2020.

Chips using 5 nm technology

 * Samsung began production of 5 nm chips (5LPE) in late 2018.
 * TSMC began production of 5 nm chips (CLN5FF) in April 2019.

Chips using 3 nm technology

 * TSMC have announced plans to release 3nm devices during 2021–2022.
 * Samsung Electronics have begun risk production of 3 nm GAAFET transistors in June of 2022.
 * Apple A17 Pro (iPhone 15 Pro)