Talk:Chip bonding

This article seems to confuse various terms. For example, die vs. package. The article seems to describe Multi-Chip Modules, but could also refer to stacked wafer architectures or similar advanced manufacturing techniques. I am not sure whether 'Chip bonding' is in general referring to what is described in this article. Major cleanup needed, perhaps even just merging with Multi-Chip Module --Cohan (talk) 18:04, 7 June 2010 (UTC)