Talk:Diamond blade

Split
The following discussion was moved from Categories for discussion/Log/2010 March 22: (--Wizard191 (talk) 01:49, 23 March 2010 (UTC))

This current article on the Diamond Blade page could be expanded to include many articles, findings and resources for readers as one page entitled Diamond Grinding. I have a list of articles that discuss this technique for diamond grinding of pavement that can expand upon this topic. Currently, if you look up diamond grinding, it takes you to the Diamond Blade page with just a category for Diamond grinding of pavement - there is so much more to the topic than this two paragraph section. Please consider the building off of this category to it's own page. —Preceding unsigned comment added by Wendyfables (talk) 16:19, 23 March 2010 (UTC) Wendyfables (talk) 16:20, 23 March 2010 (UTC)


 * Just following up on the status of removing this section to make it it's own page. Please verify that this is OK to do. Wendyfables (talk) 21:03, 29 March 2010 (UTC)


 * Yeah, I would say a split of the pavement grinding stuff would be good. Wizard191 (talk) 21:22, 29 March 2010 (UTC)

Cutting with or without water
The statement regarding cutting with water in regards to electrical saws can be interpreted a few ways. Wet saws are generally powered by electricity and have no problems as long as the unit(s) are properly grounded. I am not aware of any used that run on air but im sure those exist.

Perhaps this was in regards to cutting electrical parts that would be damaged by water?Woods01 (talk) 06:33, 12 November 2010 (UTC)

Application of diamond blade to semiconductor slicing
I was looking at a specification of a 1-inch diameter cylinder of 99.9999% pure silicon sliced into 150 um thick wafers. I would like to know how much of the cylinder would wind up as dust on the floor. I suppose some polishing would be needed to get the wafer. Oxidation of the silicon might be a problem. However, water cooling of the diamond blade might be a good idea if oxidation could be minimized. Dicing the wafer into 1000 pieces could be done by scoring the wafer. I came across an article in IEEE SSC in 1980, 1 um geometries are feasible. The IC industry probably does better than that today. In 2008, the US produced 166,000 metric tons of silicon making it the World's #5 producer. You can find how to produce Silicon from sand in your chemistry book. David R. Wright, Electrical Engineer, dwright2@mc.net —Preceding unsigned comment added by 65.42.140.14 (talk) 21:05, 20 May 2011 (UTC)