Talk:Die (integrated circuit)

Some central processing units (CPU) have an Integrated Heat Spreader (IHS) mounted on the die to protect it from damage and help spread the heat.

The die is mounted on a substrate? -- Frap 19:08, 3 November 2006 (UTC)

http://www.sweclockers.com/imagebank/30fa3/Ul5W8s.jpg

Substrate
The word substrate is often used in connection with silicon chips to mean the bulk silicon wafer upon which a thin Epitaxial layer is grown. The circuit of the die is formed in the epitaxial layer and can't be separated from the bulk silicon substrate.

Silicon wafers need to be thick enough to support their own weight during processing, but can be thinned by backgrinding most of the substrate away, before separation into individual dice.

Individual dice are fragile and need some kind of substrate to support them. This is the kind of substrate shown in the picture. It's probably a PCB which supports the thin silicon die and provides external connections and easier handling. Pavium (talk) 06:13, 28 April 2009 (UTC)

What ist the correct plural form of die: dies or dice? --134.155.99.41 23:54, 1 December 2006 (UTC)

Plural form
In the article it is written: "There are three commonly used plural forms: dice, dies, and die." But which one is the most common one? --134.155.99.41 19:35, 10 April 2007 (UTC)
 * That's hard to determine. I was able to determine that all are common.  In my own experience "dice" was normal, but not everyone agrees. Dicklyon 19:54, 10 April 2007 (UTC)

Another picture showing one chip with two dies, e.g. Intel Core2 QuadCore something
would be nice — Preceding unsigned comment added by 77.3.182.233 (talk) 19:53, 1 June 2011 (UTC)
 * cf. Multi-chip module AFAIK there is no difference between the denomination chip and die. It seems die is used by people from production, while chip is used by everybody else. Maybe because everybody else didn't distinguish between the chip, i.e. the die, and the chip carrier, people started using the word die to be precise. User:ScotXW t@lk 08:58, 10 August 2017 (UTC)

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