Talk:Die preparation

Untitled
he two and using a redirect and such. -- Rickz0rz 07:22, 12 January 2006 (UTC)

I suggest merging Wafer mounting and Semiconductor-die cutting. They're two steps of one process, die preparation. Is there a reason to have three articles instead of one? -- Perfecto 23:25, 5 November 2005 (UTC)

I agree - merge. I my mind, Wafer mounting and Semiconductor-die cutting do not contain enough information to be seperated, and since they are all part of Die preparation, they should be merged. --mabahj 10:23, 16 February 2006 (UTC)

I disagree. Semiconductor-die cutting is by itself a very complicated and involved technology. Besides, the contents seem rather outdated. Will it be acceptable to have a separate entry if there were more updated information on this?


 * More (updated) information is in general always good. The only reason I voted merge, was that boths articles were stubs. I'll change my vote if the articles increase in size. Go for it! mabahj 07:50, 14 June 2006 (UTC)

Die cutting
Die cutting is a redirect to here; however, it's also the name of a process for batch production. Can someone eloborate? --Islomaniac 973 17:31, 19 January 2007 (UTC)

I agree. Die Cutting isn't just used in semiconductor production, but is a common production method for creating packaging, presentation folders, labels, foodstuffs (such as confectionery) and lots of other things. Can we have a more general page setup for "die cutting" as a production method, with all the semiconductor stuff either under a subheading or another page? -- User: Reactor12


 * Make it a disambiguation page, since the process of cutting with dies and the process of cutting dies from wafers are completely unrelated uses of the term. Dicklyon 23:09, 25 July 2007 (UTC)

Die-cut also redirected here. I've changed the redirect to point to Die cutting disambiguation page --84.12.64.112 09:10, 25 September 2007 (UTC)