Talk:Thermally conductive pad

grease and pad
If a computer came with a thermal pad between the cpu and heatsink, but the pad has been removed, can one apply thermal grease or is a pad necessary?

Lacking information
This article doesn't really explain what a thermal pad is - only where it can be found and what function it serves. What I mean is that there is no description of the object itself. --84.250.188.136 (talk) 10:21, 19 August 2008 (UTC)


 * Well I might take care of that, however see below. Rocknrollsuicide (talk) 00:36, 5 January 2010 (UTC)

AMD?
"AMD favour the use of thermal pads on the bottom of heatsinks used with many of its processors" This is only for lidless processors (without an IHS). Most of todays desktop processors are lidded. Dunno if it's worth changing the article though... —Preceding unsigned comment added by 78.69.160.229 (talk) 08:27, 25 October 2008 (UTC)

Propose rename
I propose the article be renamed to "Thermal pad (Electronics)" since thermal pads have nothing to do with computing as such, they are in fact electronic hardware components and are used in many types of electronic equipment, not only in computers. The current name for the article is thus overly restrictive, and can not cover a proper article on what a thermal pad is, what it does, and why, where and how it is used. Rocknrollsuicide (talk) 00:36, 5 January 2010 (UTC)

Requested move

 * The following discussion is an archived discussion of a requested move. Please do not modify it. Subsequent comments should be made in a new section on the talk page. No further edits should be made to this section. 

The result of the move request was: No consensus - Page not moved  Ron h jones (Talk) 20:39, 25 January 2010 (UTC)

Thermal pad (computing) → Thermal pad (electronics) — Current page name is overly restrictive. Thermal pad (electronics) → Thermal pad (printed circuit) — Relisting as a multiple move  Ron h jones (Talk) 16:54, 16 January 2010 (UTC)

Rocknrollsuicide (talk) 22:41, 6 January 2010 (UTC)


 * Oops. Thermal pad (electronics) already exists, and appears to be a misnomer itself, the correct term being "thermally relieved pad". "Thermal" is shorthand used by printed circuit board designers. Rocknrollsuicide (talk) 01:12, 7 January 2010 (UTC)
 * Thermal pad (electronics) is of course correct, not Thermal pad (Electronics). However, it looks like a full reorganization of the three relevant articles (also Thermal pad) may be necessary. Is the current Thermal pad the primary topic? Ucucha 11:16, 12 January 2010 (UTC)
 * Current Thermal pad is most likely the more widely understood meaning of the term, after all it's something one could buy at Wal-Mart :-). Anyway, I'd rename Thermal pad (electronics) to Thermal relief. I'm familiar with designing printed circuits and this appears to be the more common term. Alternatively, I'd propose Thermal pad (printed circuit).
 * I'd really like to sort this out, so the article can be properly expanded beyond the realm of processor-heatsink interface. I've been mounting a variety of electronic devices on a variety of heatsinks for longer than I care to remember so I'm pretty practical on the subject, and I can supply suitable illustrations as well.
 * Any suggestions toward the resolution of the renaming issue will be greatly appreciated. --Rocknrollsuicide (talk) 03:53, 13 January 2010 (UTC)
 * I am an absolute ignoramus on this subject, so I'm afraid I can't be of much help. I would have a preference for "thermal relief" because that avoids the disambiguator, making the title simpler. Perhaps you can ask at WT:ELEC for some second opinions, and you might drop a message to the creator of the (electronics) article,, who is still occasionally active. Ucucha 08:26, 13 January 2010 (UTC)
 * I've set for a relisting as multiple move - I will post a message on the talk page of Thermal pad (electronics)  Ron h jones (Talk) 16:54, 16 January 2010 (UTC)


 * Comment the way this article is currently written, there's no need to move it. 76.66.197.17 (talk) 04:53, 18 January 2010 (UTC)
 * The above discussion is preserved as an archive of a requested move. Please do not modify it. Subsequent comments should be made in a new section on this talk page. No further edits should be made to this section.