User:Fhicana

Franklin Hicana or commonly known as Frank, Franky, Fran, is a process engineer in semicomductor industry

Personal life
Franklin Work experienced : Senior Test and Finishing Process Engineer (Team Leader) in Mingxin microelectronics, Account Marketing Manager for Ismeca Machines, Senior Test and Finishing Process Engineer in Fairchild Cebu Philippines, Wirebond Equipment Engineer in ASE Taiwan ROC, Maintenance Engineer in Amkor Technology Philippines

Experienced
Senior Test and Finishing Process Engineer (Team Leader) Ningbo Mingxin Microelectronics Co., Ltd Process Development Engineering (POWER and DISCRETE Packages) August 2011 – up to present 	Responsible for technical development of new packages. 	Improves manufacturing techniques, introduces new process / equipment /fixtures to production 	Continually   makes incremental, measurable    improvement in the   process developed. 	Interfaces with production and other engineering & support groups including, product and manufacturing to ensure the most efficient processing techniques. 	Develops process control or new processes developed. Performs other related job functions as required. 	Responsible for component package design, development of new package requirements and maintaining the quality of new packages for product lines under the area of responsibility. 	Conducts test and research on basic materials and properties involved in the process of packaging 	Establishes material specifications, basic materials and properties involved in the process of packaging. 	Establishes material specifications, basic materials and properties involved in the process of packaging. Establishes material specifications, package / lead outlines, drawings and engineering system such as Electronic Buildsheet or its equivalent. 	Interfaces with QA and Purchasing regarding material quality and vendor performance. 	Interfaces with Product Lines, higher technical staff management, Sales / Marketing, competitors and industry forums 	Keeps current industry status and competitive technologies and advises top management appropriately. 	Maintain cost effectiveness related to materials, process and packaging. Performs other job functions as required. 	Develops solutions to problems which have been clearly defined and have similar precedents available. Problem analysis often involves selecting the best alternative method or process from among several existing alternatives. Commonly participates as a member of a team to solve problems that fall within a limited range of specialty. 	Makes decision or provides recommendations related to specific tasks. Major or unusual issues require referral to a supervisor, manager or higher level technical staff member. Account Marketing Manager (Ismeca Machines) Aurotech Corporation Marketing Engineering Department January 2008 – July 2011 	Responsible of consolidating and coordinating all marketing and service activities with the supplier and customers. 	Responsible in ensuring that supplier needs and business plans are carried out 	Responsible in providing technical and commercial support to potential and existing customers. 	Responsible in promoting and marketing the assigned product to potential customers 	Responsible of the activities which consisting the cohesive collection of all tasks that are primarily performed to produce the requirements and other related required work products for an endeavor or projects involving ISMECA product and or equipments 	Responsible in developing strategic visions and outlining activity scopes for any identified project 	Stakeholder needs and desires into a complete set of high-quality projects 	Minimize the risk of endeavor failure due to poorly engineered required work products 	Responsible in reducing project cost by giving alternative options to the stakeholders or customers 	Responsible in improving the quality of all endeavor deliverable work products through constant communication with the principal and the customer 	Responsible for the [re]engineered business enterprise(machine retrofit, machine tooling kits, spare parts, etc.), the next version [incremental iteration] of the application, the component to be engineered, or the center to be developed, produce a formally documented consensus among all endeavor stakeholders (e.g., customer representatives, users, endeavor champions, endeavor management, developers) concerning the: •	Vision of the projects •	Requirements of the projects •	Scope of the projects •	Boundaries of the projects 	Maximize and help achieve the quality requirements (e.g. correctness, completeness, consistency, testability, and understandability) 	Maximize team productivity (e.g. reuse of requirements, reuse of conventions, and existence of examples)

Senior Test and Finishing Process Engineer Fairchild Semiconductor (Philippines) Inc. Process Development Engineering (QFN, BGA, WLCSP, POWER and DISCRETE Packages) April 2006 – January 2008

	Handles the finishing process of semiconductor products (Discrete, Automotive, Logic and Analog power and small packages (e.g. QFN’s, SOT’s) 	Works collaboratively with FAIRCHILD Global Product Groups, Factory Product Engineering and Automotive product lines, Process Engineering, Manufacturing, QA and other support groups on a new business for FSC attributed to a new product (device or package) 	Attends to line issues, provide data analysis, and their corrective measures related to qualification, Engineering Build lots and production lots 	Communicates with Product Engineering Group for issues that need customer disposition. Ensure product built satisfies customer requirements and specification. 	Ensures data collection and document completion (buy-off results and qualification data sheets) for lots as required by FAIRCHILD or by its customers 	Provides engineering reports, 8D’s (PQA’s) and other Executive Summaries to internal and external customers for engineering lots including Engineering Qualification Project Plans (EQPP) and Engineering Evaluation Qualification Reports (EEQR) 	Responsible in qualifying indirect and direct materials used in production line 	Responsible for tracking key indices to provide quality output and maintain OTD 	Responsible of qualifying equipments, testers, direct and in direct materials to be used inside the production line 	Resolve product issues by supporting in low yield analysis, evaluation and corrective action activities like Kaizen Teams and Project Management Teams 	Perform in depth product characterization and testing on customer returned samples and provide feedback to CQE group whatever findings for the proper identification between a manufacturer and customer induced failures. 	Tasked to ensure strict implementation of policies and procedures of the  Process Engineering Group in accordance to company guidelines 	Assigned to administer competitive service schemes and approaches that will enhance profitability and productivity of the engineering operations

Wirebond Process Engineer Fairchild Semiconductors (Philippines) Inc. Process Development Engineering (Power Packages) March 2006 – April 2006

	Provides technical analysis on problematic device such as TO 263 and TO 252 and design new clamping method and calibration techniques 	Create new bonding sequence in such a way that the bond head travel will utilize its movements 	Performs DOE in newly qualified capillary and derive suitable bonding parameters 	Technically and hands-on trained to standardize the technical means of handling and resolving wirebonding manufacturing concerns in the company 	Trained in the company’s Process Engineering department and was assigned to do analysis and recommend appropriate actions to resolve wirebond line concerns by evaluations, procedure enhancement and work instruction generation

Wirebond Equipment Engineer ASE (Advanced Semiconductor and Engineering) Kaohsiung Taiwan R.O.C Maintenance Engineering (Hybrid BGA) Sept. 2004 – March 2006

	Handles the wirebond equipments for semiconductor parts (e.g. BGA) 	Set up the wirebond rebuild flat form of ASE wirebond equipment engineering (XY table rebuild, bond head rebuild, work holder rebuild) 	Design a checklist which utilizes the cycle time of wirebond rebuild 	Teach technical ideas to local maintenance (Chinese) 	Educate and guide them to all proper procedures related to wire bond equipment 	Technically expert at wire bond station. Applies engineering approach to all problems encountered at wire bond station. 	Machine specialist at wire bond station. Handling critical and non-critical defect encountered during processing. 	Repair major down equipments and perform time to time monitoring for their performance 	Perform analysis in problems that affect production yield, cycle time and equipment efficiency 	Present technical reports to line leader as needed 	Perform other related tasks that may be assigned by leaders from time to time 	Handles the line with minimum supervision 	Assigned trainer to all P5 incoming Filipino or foreigner maintenance engineer

Wirebond Applications Engineer REAC Scientific System Corp. Field Engineering April 2004- Sept. 2004

	Restore and repair major hard down K&S wire bond machine 1488, 1484, 8028 	Rebuild XY table, bond head, work holder and other major consoles of wire bond machine (1488, 8028) 	Optimize and sustain problematic device in TSSOP, SOIC package and qualify new devices 	Generate report on base lining activities done in newly repaired machines

Maintenance Technician/Engineer Amkor Technology Phil. Maintenance Engineering Jan. 1999 – March 2004

	Responsible for planning and scheduling of the group’s workloads and ensuring compliance to achieves targets 	Responsible for manpower resource management and logistics preparation 	Responsible for initiating developments and improvements for better productivity of the group 	Responsible for implementation and development of projects in support of the company’s Cost Reduction Initiatives 	Responsible for trouble shooting major and minor repair of all WB machines 	Responsible for the group’s database development and maintenance, report generation, worksheets  preparation, etc. 	Responsible for the weekly release of Wirebond Indicators and other reports as needed 	 Assigned to administer competitive service schemes and approaches that will enhance profitability and productivity of the engineering operations

Trainings
	K&S 1488 Wirebond Machine Training 	K&S 8028 Wirebond Overhaul Training 	K&S 8028 Wirebond Training Level 1to 3 	K&S Maxum Advanced Training 	Conversion of Maxum to Maxum plus 	Basic operation and Maintenance of Maxum Ultra and Maxum Elite 	K&S 8028 Rebuild Program ( K&S Singapore ) 	Vitrox vision system for lead and mark vision 	Ismeca NX16 test mark and tape and reel handler 	Native vision system for mark and lead vision 	JDSU fiber and CO2 laser training ( KETECA Singapore ) 	Proficient in MS Office Applications (Excel, Word, PowerPoint) 	Possesses good planning, scheduling and strategic skills. 	Possesses good presentation and communication skills. 	Clean room and ESD Orientation 	Statistical Process Control, Engineering Statistics and SAS Jmp 	Quality Control Tools 	Failure Mode and Effect Analysis 	Failure Analysis and Reliability 	Global 8D 	Designs of Experiments (DOE) 	Problem Solving and Decision Making 	Quality Control Circle 	Process Control System 	Basic PLC 	Pneumatics 	Personal Effectiveness Program 	Mistake Proofing 	SPECS writing and Document Control 	EWB (engineering work bench) 	Foundation for Leadership Excellence 	Successful Negotiation 	Six Sigma Green Belt