User:Genrldisaray/sandbox

Speculation on Ivy Bridge's heat woes.
This section suggests that Ivy Bridge's heat problems are due, at least in part, to the use of thermal paste instead of fluxless solder. The "three" references are, in fact, one reference, because the other two just reference the same article at overclockers.com. However, after a little searching, I found this article which claims the change to thermal paste was not at fault. I'd like to see some more information on this, but it seems they did their homework, unlike overclockers, which is mere speculation. Sure, mathematical formulas might be great idea to demonstrate the problem, but not if they don't accurately reflect the real world. Thoughts? --Manguene (talk) 06:06, 7 May 2012 (UTC)


 * The problem with the article you mention is that the testing was done by removing the IHS and applying TIM directly to the die, then mounting the CPU cooler to the bare die. A more accurate way of measuring the impact of the Intel thermal paste would be to remove it, apply an aftermarket TIM that is known to perform well and then replace the IHS.  I believe this would provide a more "apples to apples" comparison by taking the heat spreader out of the equation. In this article the author replaced the stock paste with two different TIMs and saw significant improvement in load temps, as well as maximum clock speeds.  I agree with you that we need more information (and it doesn't help when article authors frame their speculation as facts), I just wanted to point out that there is some evidence out there that the thermal paste is at least partially to blame for Ivy Bridge's heat issues. Genrldisaray (talk) 03:48, 28 May 2012 (UTC)