User:Heavelye/sandbox

NDUKA NNAMDI EKERE

Born 1958 Nationality Nigerian Occupation Chartered Engineer Known For First Black Winner of the American Society of Manufacturing Engineering Total Excellence in Electronics Manufacturing Prize in 2006.

Spouse Jane Ifeyinwa Ekere (nee Epunam) Academic Background Alma matter University of Nigeria Nsukka, Nigeria (Agbebi Lion), Loughborough University and Manchester University of Science and Technology.

Academic work Machester University of Science and Technology, University of Salford, University of Greenwich and University of Wolvehampton.

Professor Nduka Nnamdi Ekere (1958 - ) born in Afugiri, Umiahia, Abia State NIgeria is a Chatered Engineer (Manufacturing). he was appointed a Profesor of Manufacturing Engeering by the University of SAlford, Machester United Kingdom in 1998 and is the first European-based scientist and the first Black Winner of the American Society of MAnufacturing Engineering Total Execellence in Electronics Manafacturing Prize in 2006 [1] and https://[www.herald.co.zw/so-blacks-can-invent-after-all/]

Contents 1. Education 2. Career 3. Publications 4. Notes 5. External links

1. 'EDUCATION Professor Ndy Ekere attended Williams Memorial Secondary School, Afugiri Umuahia where before gaining admission to the University of Nigeria, Nsukka in 1976 to Mechanical Engineering []. He graduated top of his class, with first class honours in 1981 and following completion of his National Youth Service Corps assignment, he joined the Shell Petroluem Development Corporation in 1982 as a Mechanical Engineer (Project Construction and Terminals OPerations)[]. Subsequently, he attended the Loughborough University, United Kingdom [], where he studied for and obtained the Master of Science Degree in Flexible MAnufacturing and Robotics in 1984 under a Federal Government of Nigeria Overseas Scholarship. He then proceeded to the University of Science and Techonolgy, Machester United Kingdom [], where he obtained the PhD in Manufacturing Engineering in 1987, also under a Federal Government of Nigeria Overseas Scholarship. Professor Ndy Ekere became a chatered Engineer (Registered with the Engineering Council, United Kingdom)in 1989. He is a fellow of fellow of the Institute of Engineering and Technology (FIET, 2004), a Senior Fellow of the Higher Education Academy (SFHEA, 2017) and was he elected to fellowship of the Nigeria Academy of Science (FAS, 2019).

2. CAREER Professor Ndy Ekere started his engineering career with the Shell Petroluem Development Corporation in 1982 as a Mechanical Engineer (Project Construction and Terminal Operations); and upon the completion of his PhD studies in 1987, he was retained by the University of Manchester Institute of Science and Technology as a visiting scholar [1987] and then was appointed a postdoctoral research fellow [1988]. He moved on to the then Nottingham Trent Polytecnic as a Lecturer in Production Engineering [], and then moved on to the University of Salford as a Lecturer in Manufacturing Engineering in 1989 [], where he was appointed a Professor of Manuufacturing Engineering in 1998. During his time with Salford, he established and led the Electronics Manufacturing Engineering Research Group (EMERG) and he served as the Director of Research for the School of Aeronautical, Mechanical and Manufacturing Engineering. He left the University of Salford to take up appointment with the University of Greenwich in 2002 as the Head and later Dean of School of Engineering []. Following the completion of ten years of service with Greenwich as Head/Dean of School of Engineering; he was appointed the Dean of School of Technology with the University of Wolverhampton in 2012 []. He led a change managemnt programme at the University of Wolverhampton which led to the formation of the new Faculty of Science and Engineering and he was appointment the pioneer DEan of Faculty [2013 - 2016][]. He served on University Corporate Management Team and was appointed the UNiversity's Ambassador for Africa []. I addition to his very strong track ecord of acheivements at the Head of School, DEan of School and DEan of Faculty levels, Professor Ndy Ekere also a strong track record and profile in Electronics Interconnections and Relaibility Engineering Research. His research grant funding includes 25 EPSRC and industry funded projects worth over £4 miilionin which he led on several national and international research consortia; and he have published over 170 journal and conference papers []. He was awarded the American Society of MAnufacturing Engineering 2006 Total Excellence in Electronics Manufacturing prize in recognition of his contributions to the research in Electronics Manafcaturing Engineering [2]; and the Royal Society Visting Profesorship with the City University of Hong Kong in 2007[]. The results from his research projects which is focused on increasing science - based understanding of electronics manufacturing processes and materials, have also helped R&D staff, line managers and operators world-wide to increase process yield, improve product quality and reliability- thereby increasing their competitiveness in the global market place. the focus of the recent research work carried out by the EMERG to identify, explore and develop suitable assembly and packaging technologies both to meet the challenges of miniaturisation facing the electronics industry and to suppoprt virtual development of new and low cost electronic products. As new materials emerge and the industry incorporate many different assembly materials into the assembly process, it is also critical to be able to describe the intercations between materials and process parameters, and the accurate cahracterisation and modelling is an important pre-requisite to acheiving high yield and reliability. in terms of future work, the focus of Professor Ekere's activity will continue to be on process modelling to develop the process knowledge required to support the "virtual" development of new and low cost electronic products. Professsor Ekere's team have succesfully developed the "Dynamic tools" for optimizing the design and manufacture/assembly line perfromance in a "virtual environment" so that the commercial product build is right first time. The use of these empirically -enhanced process models for performance prediction is the key for gaining a greater undertanding of key phenomena governing product manufacture, assembly, in-service reliability, causes of failure, dis-assembly and recycling. LIST OF AWARDS

3. PUBLICATIONS Authored and or co-authored 170+ papers (including 90 papers in peer referred archival journals)and 80 referred conferences; and over 50 consulancy reports (for further details on these publication, please see) ORCID: https://orcid.org/0000-0002-9955-8244 Research Gate: https://www.researchgate.net/profile/NN ekere/reputation GoogleScholar: http://scholar.google.co.uk/citatios?user=alvwCEAAAAJ&hl=en PUBLICATION 1. Jeong, I.H.; Eslami Majd, A.; Jung, J.P.; Ekere, N.N. (2020), "Electrical and Mechanical Analysis of Different TSV Geometries", Metals 2020, Vol 10, pp 467-468. https://doi.org/10.3390/met10040467 2. Eslami Mjad, A., & Ekere, N.N. (2019). Numerical analysis on thermal crack initiation due to homogeneous solder coating on the strip interconnection of photo-volatic modules. Solar Energy, 194,649-655. dio:10.1016/j.solener.2019.10.092 3.Ogbomo,O.O., Amalu, E.H., Ekere, N.N., & Olagbegi, P.O.(2018). Effect of operating temperature on degradaton of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climated. Solar Energy, 170, 682-693. doi:10.1016/j.solener.2018.06.007. 4.Zamai, M.T, Ekere N.N., Oduoza,C.F.,Amalu, E.H.(2017)Evaluation of Thermomechanical damageand fatigue life of solar cell solder interconnections. Robotics and Computer Integrated Manufacturing, 47. 37-43. doi:10.1016/j.rcim.2016.12.008 5 Ogbomo, O. O., Amalu, E. H., Ekere, N. N., & Olagbegi, P. O. (2017). A review of photovoltaic module technologies for increased performance in tropical climate. Renewable and Sustainable Energy Reviews, 75, 1225-1238. doi:10.1016/j.rser.2016.11.109 6 Ogbomo, O. O., Amalu, E. H., Ekere, N. N., & Olagbegi, P. O. (2017). Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage. Procedia Manufacturing, 11, 1145-1152. doi:10.1016/j.promfg.2017.07.236 7 Amalu, E. H., & Ekere, N. N. (2016). Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies. Journal of Manufacturing Systems, 39, 9-23. doi:10.1016/j.jmsy.2016.01.002 8 Zarmai, M. T., Ekere, N. N., Oduoza, C. F., & Amalu, E. H. (2016). Optimization of thermomechanical reliability of solder joints in crystalline silicon solar cell assembly. Microelectronics Reliability, 59, 117-125. doi:10.1016/j.microrel.2015.12.031 9 Amalu, E. H., Ekere, N. N., Zarmai, M. T., & Takyi, G. (2015). Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method. Finite Elements in Analysis and Design, 107, 13-27. doi:10.1016/j.finel.2015.08.004 10 Zarmai, M. T., Ekere, N. N., Oduoza, C. F., & Amalu, E. H. (2015). A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly. Applied Energy, 154, 173-182. doi:10.1016/j.apenergy.2015.04.120 11 Njoku, J. E., Mallik, S., Bhatti, R., Amalu, E. H., & Ekere, N. N. (2015). Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient. In Proceedings of the International Spring Seminar on Electronics Technology Vol. 2015-September (pp. 231-236). doi:10.1109/ISSE.2015.7247996 12 Amalu, E. H., Ekere, N. N., Oduoza, C. F., & Zarmai, M. T. (2015). Evaluation of garofalo creep model for lead-free solder joints in surface mount components. In NSTI: Advanced Materials - TechConnect Briefs 2015 Vol. 4 (pp. 282-285). 13 Zarmai, M. T., Ekere, N. N., Oduoza, C. F., & Amalu, E. H. (2015). Effect of intermetallic compound thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly. In NSTI: Advanced Materials - TechConnect Briefs 2015 Vol. 4 (pp. 286-289). 14 Kumar, S., Mallik, S., Ekere, N., & Jung, J. (2013). Stencil printing behavior of lead-free Sn-3Ag- 0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps. Metals and Materials International, 19(5), 1083-1090. doi:10.1007/s12540-013-5025-z 15 Mallik, S., Chan, E. H. L., & Ekere, N. (2013). Nonlinear viscoelastic characteristics of Sn-Ag-Cu solder pastes used in electronics assembly applications. Journal of Materials Engineering and Performance, 22(4), 1186-1193. doi:10.1007/s11665-012-0360-7 16 Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., & Ekpu, M. (2013). Finite element analysis of the effect of silver content for Sn-Ag-Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28, 192-207. doi:10.1016/j.engfailanal.2012.10.008 17 Mallik, S., & Ekere, N. (2013). Metal matrix composites as thermal management materials for automotive applications. In Engineered Metal Matrix Composites: Forming Methods, Material Properties and Industrial Applications (pp. 113-126). 18 Amalu, E. H., & Ekere, N. N. (2012). High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. Microelectronics Reliability, 52(12), 2982-2994. doi:10.1016/j.microrel.2012.07.024 19 Amalu, E. H., & Ekere, N. N. (2012). Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling. Computational Materials Science, 65, 470-484. doi:10.1016/j.commatsci.2012.08.005 20 Amalu, E. H., & Ekere, N. N. (2012). Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Microelectronics Reliability, 52(11), 2731-2743. doi:10.1016/j.microrel.2012.04.004 21 Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Alam, M. O., Amalu, E. H., & Ekpu, M. (2012). Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52(7), 1409-1419. doi:10.1016/j.microrel.2012.01.015 22 Amalu, E. H., & Ekere, N. N. (2012). High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212(2), 471-483. doi:10.1016/j.jmatprotec.2011.10.011 23 Amalu, E. H., Ekere, N. N., Bhatti, R. S., Mallik, S., Takyi, G., & Ibhadode, A. O. A. (2012). Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. In Advanced Materials Research Vol. 367 (pp. 287-292). doi:10.4028/www.scientific.net/AMR.367.287 24 Otiaba, K. C., Ekere, N. N., Amalu, E. H., Bhatti, R. S., & Mallik, S. (2012). Thermal management materials for electronic control unit: Trends, processing technology and R &D challenges. In Advanced Materials Research Vol. 367 (pp. 301-307). doi:10.4028/www.scientific.net/AMR.367.301 25 Ekpu, M., Bhatti, R., Ekere, N., Mallik, S., & Otiaba, K. (2012). Effects of thermal interface materials (solders) on thermal performance of a microelectronic package. In DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 154-159). 26 Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Ekpu, M., & Adeyemi, J. (2011). Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 (pp. 115-119). 27 Amalu, E. H., Ekere, N. N., & Aminu, G. (2011). Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings (pp. 208- 213). doi:10.1109/ICASTech.2011.6145173 28 Amalu, E. H., Ekere, N. N., & Aminu, G. (2011). Modeling high temperature reliability of flip chip Pb-free solder joint at varying bond pad diameter. In AES-ATEMA International Conference Series - Advances and Trends in Engineering Materials and their Applications (pp. 385-393). 29 Ekpu, M., Bhatti, R., Ekere, N., Mallik, S., Amalu, E., & Otiaba, K. (2011). Investigation of effects of heat sinks on thermal performance of microelectronic package. In 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings (pp. 127-132). doi:10.1109/ICASTech.2011.6145164 30 Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Amalu, E. H., & Ekpu, M. (2011). Thermal effects of die-attach voids location and style on performance of chip level package. In 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings (pp. 231- 236). doi:10.1109/ICASTech.2011.6145176 31 Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., Alam, M. O., & Amalu, E. H. (2011). Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51(12), 2031-2043. doi:10.1016/j.microrel.2011.05.001 32 Amalu, E. H., Lau, W. K., Ekere, N. N., Bhatti, R. S., Mallik, S., Otiaba, K. C., & Takyi, G. (2011). A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. In Microelectronic Engineering Vol. 88 (pp. 1610-1617). doi:10.1016/j.mee.2011.02.104 33 Amalu, E. H., Ekere, N. N., & Mallik, S. (2011). Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32(6), 3189-3197. doi:10.1016/j.matdes.2011.02.045 34 Marks, A. E., Ekere, N. N., Mallik, S., & Bhatti, R. (2011). Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23(2), 75-84. doi:10.1108/09540911111120140 35 Mallik, S., Ekere, N., Best, C., & Bhatti, R. (2011). Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31(2-3), 355-362. doi:10.1016/j.applthermaleng.2010.09.023 36 Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., & Amalu, E. H. (2011). Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 37 Ekpu, M., Bhatti, R., Ekere, N., & Mallik, S. (2011). Advanced thermal management materials for heat sinks used in microelectronics. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 38 Mallik, S., Ekere, N. N., & Bhatti, R. (2011). Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. ASTM Special Technical Publication, 1530, 168-185. doi:10.1520/JA1103043 39 Mallik, S., Ekere, N. N., & Bhatti, R. (2010). Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7(9). doi:10.1520/JAI103043 40 Durairaj, R., Man, L. W., Ekere, N. N., & Mallik, S. (2010). The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31(3), 1056-1062. doi:10.1016/j.matdes.2009.09.051 41 Mallik, S., Ekere, N. N., Marks, A. E., Seman, A., & Durairaj, R. (2010). Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19(1), 40-45. doi:10.1007/s11665-009-9448-0 42 Mallik, S., Schmidt, M., Bauer, R., & Ekere, N. N. (2010). Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance. Soldering and Surface Mount Technology, 22(4), 42-49. doi:10.1108/09540911011076871 43 Takyi, G., & Ekere, N. N. (2010). Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs. Soldering and Surface Mount Technology, 22(3), 17-21. doi:10.1108/09540911011054154 44 Takyi, G., & Ekere, N. N. (2010). Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering. Soldering and Surface Mount Technology, 22(2), 37-42. doi:10.1108/09540911011036271 45 Amalu, E. H., Lui, Y. T., Ekere, N. N., Bhatti, R. S., & Takyi, G. (2010). Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In AIP Conference Proceedings Vol. 1315 (pp. 639-644). doi:10.1063/1.3552519 46 Mallik, S., Bauer, R., Hübner, F., & Ekere, N. N. (2010). Evaluating print performance of Sn-Ag- Cu lead-free solder pastes used in electronics assembly process. In AIP Conference Proceedings Vol. 1315 (pp. 33-38). doi:10.1063/1.3552465 47 Mallik, S., Ekere, N. N., Durairaj, R., Marks, A. E., & Seman, A. (2009). Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials and Design, 30(10), 4502-4506. doi:10.1016/j.matdes.2009.05.028 48 Amalu, E. H., Ekere, N. N., & Bhatti, R. S. (2009). High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In ICAST 2009 - 2nd International Conference on Adaptive Science and Technology (pp. 146-153). doi:10.1109/ICASTECH.2009.5409731 49 Durairaj, R., Ramesh, S., Mallik, S., Seman, A., & Ekere, N. (2009). Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30(9), 3812-3818. doi:10.1016/j.matdes.2009.01.028 50 Durairaj, R., Mallik, S., Seman, A., & Ekere, N. N. (2009). Investigation of wall-slip effect on leadfree solder paste and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34(5), 799-810. doi:10.1007/s12046-009-0046-5 51 Durairaj, R., Mallik, S., Seman, A., Marks, A., & Ekere, N. N. (2009). Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209(8), 3923-3930. doi:10.1016/j.jmatprotec.2008.09.013 52 Durairaj, R., Man, L. W., Ramesh, S., Wea, L. C., Leng, E. P., Ekere, N. N.,. . . Seman, A. (2009). Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesives. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 422-426). doi:10.1109/EPTC.2009.5416511 53 Mallik, S., Thieme, J., Bauer, R., Ekere, N. N., Seman, A., Bhatti, R., & Durairaj, R. (2009). Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 869- 874). doi:10.1109/EPTC.2009.5416423 54 Bernasko, P. K., Mallik, S., Ekere, N. N., Seman, A., & Takyi, G. (2009). Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 986-990). doi:10.1109/EPTC.2009.5416398 55 Durairaj, R., Mallik, S., Seman, A., Marks, A., & Ekere, N. N. (2008). Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. doi:10.1109/IEMT.2008.5507801 56 Seman, A., Ekere, N. N., Ashenden, S. J., Mallik, S., Marks, A. E., Durairaj, R., & IEEE. (2008). In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications. In EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3 (pp. 1448-+). doi:10.1109/EPTC.2008.4763635 57 Durairaj, R., Mallik, S., Seman, A., Marks, A., Ekere, N. N., & IEEE. (2008). Investigation of Wall-slip Effect on Paste Release Characteristic in Flip chip Stencil Printing Process. In EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3 (pp. 1328- +). doi:10.1109/EPTC.2008.4763615 58 Seman, A., Ekere, N. N., Ashenden, S. J., Mallik, S., Marks, A. E., & Durairaj, R. (2008). Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 209- 214). doi:10.1109/ESTC.2008.4684351 59 Mallik, S., Ekere, N. N., Marks, A. E., Seman, A., & Durairaj, R. (2008). Modelling of the timedependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 1219- 1223). doi:10.1109/ESTC.2008.4684527 60 Mallik, S., Schmidt, M., Bauer, R., & Ekere, N. N. (2008). Influence of solder paste components on rheological behaviour. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 1135-1140). doi:10.1109/ESTC.2008.4684512 61 Marks, A. E., Mallik, S., Ekere, N. N., & Seman, A. (2008). Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 829-832). doi:10.1109/ESTC.2008.4684459 62 Wang, W., Liu, Z. D., Tian, Z. J., Huang, Y. H., Liu, Z. X., & Ekere, N. N. (2008). Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 593- 596). doi:10.1109/ESTC.2008.4684417 63 Durairaj, R., Mallik, S., & Ekere, N. N. (2008). Solder paste characterisation: Towards the development of quality control (QC) tool. Soldering and Surface Mount Technology, 20(3), 34-40. doi:10.1108/09540910810885705 64 Mallik, S., Ekere, N. N., Marks, A. E., & Durairaj, R. (2008). An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20(2), 3-10. doi:10.1108/09540910810871511 65 Mallik, S., Ekere, N. N., Durairaj, R., & Marks, A. E. (2007). A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (pp. 165- 171). doi:10.1109/IEMT.2007.4417065 66 Mallik, S., Ekere, N. N., Durairaj, R., Marks, A. E., & IEEE. (2007). A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection. In 32ND IEEE/CPMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM (pp. 96-+). Retrieved from http://gateway.webofknowledge.com/ 67 Marks, A. E., Mallik, S., Ekere, N. N., & Durairaj, R. (2007). Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (pp. 14-19). doi:10.1109/IEMT.2007.4417048 68 Winter, M., Durairaj, R., Ekere, N. N., & Bauer, R. (2006). Rheological characterization of solder pastes with different procedures. In ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings (pp. 511- 516). doi:10.1109/ISSE.2006.365159 69 Winter, M., Durairaj, R., Ekere, N. N., Bauer, R., & IEEE. (2006). Rheological characterization of solder pastes with different procedures. In 2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (pp. 475-+). Retrieved from http://gateway.webofknowledge.com/ 70 Durairaj, R., Mallik, S., Marks, A., Winter, M., Bauer, R., & Ekere, N. N. (2006). Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. In ESTC 2006 - 1st Electronics Systemintegration Technology Conference Vol. 2 (pp. 995-1000). doi:10.1109/ESTC.2006.280132 71 Saiam, B., Ekere, N. N., & Durairaj, R. (2006). A study of Inter-Metallic Compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints. In ESTC 2006 - 1st Electronics Systemintegration Technology Conference Vol. 2 (pp. 988-994). doi:10.1109/ESTC.2006.280131 72 Durairaj, R., Seman, A., & Ekere, N. N. (2006). Development of Quality Control (QC) tools for solder pastes used for flip chip assembly based on oscillatory tests. In ESTC 2006 - 1st Electronics Systemintegration Technology Conference Vol. 1 (pp. 347-353). doi:10.1109/ESTC.2006.280024 73 Hillman, S. R., Mannan, S. H., Durairaj, R., Seman, A., Ekere, N. N., Dusek, M., & Hunt, C. (2005). Correlation between jamming and skipping during solder paste printing. Soldering and Surface Mount Technology, 17(4), 17-26. doi:10.1108/09540910510630395 74 Jackson, G. J., Hendriksen, M. W., Kay, R. W., Desmulliez, M., Durairaj, R. K., & Ekere, N. N. (2005). 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International Journal of Production Research, 27(4), 599-611. doi:10.1080/00207548908942571 NATIONAL, INTERNATIONAL AND OTHER ACTIVITIES [1]. The Parliamentary Scientific Committee, Member Representing the University of Wolverhampton (2012- to date), www.scienceinparliament.org.uk [2] Academic Adviser for the Commonwealth Scholarships Commission in the UK (2013 to Date) https://www.gov.uk/government/uploads/system/uploads/attachment_data/file/671985/Annual-Report-2017.pdf [3]. Member, EPSRC/UKRI Peer Review College, https://epsrc.ukri.org/files/funding/assessment-process/fullcollegemembersname/ [2000-2002, 2005- 2009, 2009 to Date] [4] Member of the Editorial Board, Academy Journal of Science and Engineering, Nigerian Defence Academy Nigeria (2017 to date), http://www.academyjsekad.edu.ng/editorial.html [5] International Editor, Journal of the Microelectronics and Packaging Society, 2017 to date, http://www.koreascience.or.kr/journal/AboutJournal.jsp?kojic=MOKRBW Notes [edit] [1] “Electronics Packaging and Interconnection is there a limit to miniaturisation”, The Institution of Engineers, Malaysia, 28th August 2019, http://www.myiem.org.my/download/downloadlink.aspx?fn=17681_Flyer_280819.pdf&id=17681 [2] “The Future of Electronics Packaging is Spintronics, Says Professor Ekere”, Covenant University News Online 29th March 2019, https://covenantuniversity.edu.ng/News/The-Future-of-Electronics-Packaging-is-Spintronics-Says-Professor-Ekere [3] “Options for developing the Nigerian automotive industry”, Businesssday Online 19 December 2016, http://www.businessdayonline.com/options-developing-nigerian-automotive-industry/ [4] “Middle East links with Wolverhampton”, University Business, 9 October 2014, http://universitybusiness.co.uk/Article/middle_east_links_with_wolverhampton [5] “THE Campus roundup”, Times Higher Education, 12 December 2013, https://www.timeshighereducation.com/news/campus-round-up-12-december-2013/2009704.article [6] “World Cup star Roger Milla teams up with University”, Birmingham Mail News, 9 December 2013, http://www.birminghammail.co.uk/news/health/world-cup-star-roger-milla-6387537 [7] “Multimedia Centre For Vulnerable Children in Yaounde”, Business Cameroon, 21 October 2013, http://www.businessincameroon.com/tags/university-of-wolverhampton [8] “University launches new Science and Engineering faculty”, Business Information Portal, 20 June 2013 http://www.thebiponline.co.uk/bip/university-launches-new-science-and-engineering-faculty/ [9] “New links with Nigeria forged”, The Birmingham Press, 27 February, 2013, http://thebirminghampress.com/2013/02/new-links-with-nigeria-forged/ [10] “University Welcomes Aspiring Arkwright Engineers”, The Rochester Bridge Trust News, January 19, 2013, http://www.rbt.org.uk/news/universitywelcomes- aspiring-arkwright-engineers/ [11] “University of Wolverhampton appoints new technology Dean”, The Business Desk, 31 May 2012, http://www.thebusinessdesk.com/westmidlands/news/316659-university-of-wolverhampton-appoints-new-dean [12] “THE Appointments”, Times Higher Education 3 May, 2012 https://www.timeshighereducation.com/news/appointments/419808.article [13] “Warden Research new Bridge testing techniques”, The Rochester Bridge Trust News, 6 April 2011, http://www.rbt.org.uk/news/wardens-research-new-bridge-testing-techniques/ [14] “University of Greenwich holds international conference on job skills”, OnlyKent Jun 30, 2010, http://www.onlykent.com/20100630/university-of-greenwich-holds-international-conference-on-job-skills/ [15] “Why aren’t we attracting more girls? “, The Woman Engineer, Vol 18, Number 2, Winter 2008, p7 [16] “Dr Ndy Ekere was Honored by SME with 2006 TEEM Award”, Society of Manufacturing Engineers, 9 June 2006, https://news.thomasnet.com/companystory/dr-ndy-ekere-honored-by-sme-with-2006-teem-award-487757