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Technology
Like Ivy Bridge before it, Haswell has 22 nm, 3D trigate transistors. The mainstream processors have up to 4 cores, native support for up to 32 GB of dual-channel DDR3 memory, 16 PCIe 3.0 lanes, 64 KB (32 KB Instruction + 32 KB Data) L1 cache and 256 KB L2 cache per core. Chips named i5 4500 and higher support Intel Transactional Synchronization Extensions (TSX), except for "R" models, those with Iris Pro, and "K" models, those with unlocked CPU multipliers. To decrease overall system power consumption, Intel integrated a voltage regulation module onto the CPU die that controls voltage for the CPU, on-die GPU, system I/O and the integrated memory controller. The "Fully Integrated Voltage Regulator" (FIVR) is one fiftieth of the size of a motherboard VRM, and ramps voltage up or down five-to-ten times faster allowing for finer-grain throttling which translates to lower power consumption. While the FIVR reduces overall system power consumption, it increases the power consumption, and thus thermal output, of the CPU itself which negatively affects overclocking.

The unreleased enterprise/server variants, Haswell-EP and Haswell-EX, and enthusiast-class desktop platform Haswell-E will support DDR4 memory, and have 40 PCIe 3.0 lanes. Haswell-E, due to be released in the second half of 2014, will have up to 8 cores.

Haswell chips have four arithmetic logic unit to improve integer performance over Ivy Bridge's three. Intel added a third address generation unit and second branch prediction unit to streamline the 14 to 19 stage instruction pipeline, additionally, the instruction decode queue, which holds instructions after they have been decoded but before they have been executed, is no longer statically partitioned between the two threads that each core can service. "Haswell New Instructions" are an instruction set introduced with Haswell that include Advanced Vector Extensions 2 (AVX2), gather, BMI1, BMI2, LZCNT and FMA3 support.

Integrated graphics processors
There are four versions of Haswell's integrated graphics processors; GT1, GT2, GT3 and GT3e, all have hardware support for Direct3D 11.1 and OpenGL 4.2. Ivy Bridge IGPs had up to 16 execution units whereas the Haswell's IGPss have up to 40. For GT3e Intel introduced embedded DRAM (eDRAM) to address a common bottleneck of integrated graphics, memory access speeds. Named Crystalwell, it is a separate die with 128 MB of DRAM built into the chip of products with Iris Pro 5200. The eDRAM can be shared by the CPU or GPU depending on the workload and, as such, is treated as L4 cache. Because it is on-chip, it can provide faster memory access than traditional RAM, up to 50 GB/s, however, Intel claims that it would take 100 - 130 GB/s transfer speeds with GDDR to achieve the same real-world performance.