User:Jcarroll/Dr. Fred Barlow

Title
Advancements in Electronic Packaging

Abstract
Demand for increased performance and functionality in electronic products continues to increase. These trends coupled with a desire for reduced product form factors continue to create significant challenges for electronic packaging. Some of the challenges include higher operating speeds, signal integrity, as well as the need to incorporate thinned die, die stacks, and increased requirements for thermal management. This presentation will provide an overview of the trends in electronic packaging with a particular emphasis on high-speed digital products.

In addition, this presentation will describe the newly expanded microelectronics program at the Moscow campus of the University of Idaho. The curriculum now includes a course on electronic packaging as well as second course on microelectronic device fabrication. Both of these course offer undergraduate and graduate sections and are available via the Internet through the Educational Outreach office.

Bio
Fred Barlow earned a Bachelors of Science in Physics and Applied Physics from Emory University, a Masters of Science in Electrical Engineering from Virginia Tech, and a Ph.D. in Electrical Engineering from Virginia Tech. He is currently working as an Associate Professor in the Electrical and Computer Engineering Department at University of Idaho with an emphasis on electronic packaging. In the past, Dr. Barlow worked for several Universities including Virginia Tech, and the University of Arkansas where he held the position of Associate Department Head. He has served as the major professor for twenty graduate students, and served as PI or Co-PI on over 3.8 million dollars of funded research. Dr. Barlow has published over seventy papers, and is coeditor of the Handbook of Thin Film Technology (McGraw Hill, 1998), and coeditor of the Handbook of Ceramic Interconnect Technology (CRC Press, 2007). He is also a Senior Member of the International Microelectronics and Packaging Society (IMAPS), and editor in chief of the Journal of Microelectronics and Electronic Packaging.