User:Jcperez4/3D Computer Chip

3D Computer Chip
The three-dimensional computer chip is made of many interconnected chips stacked on one another. This 3-D chip enhances technology because not like a two-dimensional layout, that can only be miniaturized horizontally, it can be constructed vertically which eliminates the limits of the 2-D chip. The first 3-D chip was named the Rochester Cube after the University of Rochester in which it was invented. It is a very complex piece of technology that is still under development but it will also introduce different features that will advance technology.

Purpose
The smaller the size of a two-dimensional chip, the faster information can travel through it. Researchers believe that eventually the chip will not be able to be miniaturized any farther because as it decreases with size, the amount of heat produced by the chip will negate the gains of making it smaller. This heat is produced because the tighter the circuits of the chip get the more thermal energy created because thinner wires have greater resistance. The 3-D chip was invented to eliminate this problem because the processing components are stacked and connected. By layering these chips, the communication between them would be much faster than having the chips connected side by side, as in a planar layout. This chip will
 * Increase device bandwidth: The increase of rate at which data gets transferred.
 * Decrease form factor: The decrease in the physical dimensions of the component.
 * Reduce energy: It limits the power consumption because of the smaller inner connections.

First 3D Processor
The first 3-D processor was created at the University of Rochester by Professor Eby Friedman and his students. The chip runs at a 1.4 GHz and it was designed for optimized vertical processing between the stacked chips which gives the 3-D processor abilities that the traditional one layered ship could not reach. When designing this processor, Professor Friedman and his students knew that they were going to face many difficulties because of the complexity of the design. The difficulties of the three-dimensional chip are trying to make all of the layers work in harmony without anything obstacles that interferes a piece of information to go from one layer to another.

Features
These features will be able to be performed at the same time
 * Synchronicity: When two or more unrelated events occur in an instant.
 * Power distribution
 * Long-distance signaling