User:Mindy2710/Tokyo Electron

Tokyo Electron Limited (TEL) is a leading supplier of #REDIRECT semiconductor and #REDIRECT flat panel display production equipment worldwide. In Japan, TEL also distributes computer network related products and electronic components of global leading suppliers. The company is headquartered in Tokyo, Japan, and is listed on the Tokyo Stock Exchange.

Company History
TEL was established in 1963 by Tokuo Kubo and Toshio Kodaka as Tokyo Electron Laboratories. The company began business as a technical trading company exporting car radios. They soon noted the success of American IC manufacturers and sensed an opportunity. TEL pursed distribution rights for thermal furnaces and IC testers from American companies to Japanese electronics manufacturers, helping launch the Japanese IC manufacturing industry. In the 1970’s TEL began exploring manufacturing, producing line printers, growing to be the second largest printer manufacturer in Japan. As business needs changed, their manufacturing gradually shifted to semiconductor equipment manufacturing. In the mid-1970’s, the world economy was struggling. TEL chose this time to focus the business into semiconductor equipment. The 1980’s saw TEL greatly expand their in-house production and research capabilities, with the launch of new factories and the Process Technology Center. In 1989, the company became the largest manufacturer of semiconductor equipment in the world, a position they held for several years. TEL began a global expansion in the mid-1990’s by beginning to directly distribute and support their products in the US and in Europe. In recent years, the company has also developed research and development facilities in these markets. Tokyo Electron is currently the world’s second largest manufacturer of semiconductor equipment.

Semiconductor Manufacturing Equipment
TEL’s primary business is developing and manufacturing equipment used in the production of semiconductors (IC’s) for use in electronic applications. TEL provides products and services to customers through a global network of approximately 90 locations in 15 countries in the U.S., Europe, and Asia.

Tokyo Electron’s semiconductor production equipment covers most of the major process steps in semiconductor production. Coater/Developer: Tools used intensively in photolithography to deposit uniform thin films used to define millions of microscopic circuit elements on the surface of wafers.

Etch Systems:	Equipment using high-energy ions from a plasma to remove materials for dual-damascene, poly gate, low-k, self-aligned contact (SAC) and deep trench pattern formation.

Thermal Processing: Vertical thermal processing systems for general oxidation and annealing, deposition, LPCVD, and a variety of other applications.

Surface Preparation Systems: Automated wet and dry chemistry systems used to remove contaminants from the wafer surface and to prepare the surface for further processing.

Single wafer deposition: Equipment employing advanced chemical vapor deposition (CVD), oxidation or nitridation technologies to deposit films including tungsten, tungsten silicide, titanium, titanium nitride, and tantalum oxide.

Wafer Probe Systems: Equipment providing electrical testing of finished devices on whole or diced wafers or in wafer-level packages.

Optical Digital Profilometry: High-speed computational platform for both stand-alone and integrated metrology (IM) applications using non-destructive scatterometry-based data to determine device profiles, critical dimensions, and multiple layer film thickness.

Material Modification/Doping: Systems using a directed energetic chemical beam to produce extremely shallow doping, thin film deposition or surface modifications.

Corrective Etching/Trimming: Systems using programmed processes to compensate for electrical or material variations Advanced Inspection Metrology: E-beam wafer defect inspection systems for a variety of physical and voltage contrast defect applications.

Flat Panel Display Manufacturing Equipment
Leveraging the technology and expertise accumulated from its strong semiconductor production equipment business, TEL also produces Flat Panel Display (FPD) production equipment used in the manufacturing of displays. FPD Plasma Etch Systems/Ash Systems FPD Coaters/Developer

MEM’s Manufacturing equipment
The micro-mechanical structure of a MEMS device is processed at a micron to sub-millimeter scale on silicon substrate and is then used in sensor, actuator, or other applications. Today this technology is being considered for use in super high density 3-dimensional packaging techniques such as CoC (Chip on Chip) or WoW (Wafer on Wafer). TEL provides unique manufacturing and test equipment for the fabrication of MEMS devices, created out of their extensive experience in the Semiconductor market. TEL also provides process and prototyping services to customers who would like to design and develop MEMS devices using an in-house 6" MEMS fabrication line. Wafer level test sensor

Electronic Components & Computer Networks Distributing
Semiconductor Products Computer Networks Software Boards and General Electronic Components

Photovoltaic Cell Production Equipment
・	Joint Development with Sharp Plasma CVD System for thin-film silicon PV ・	Alliance with Oerlikon Solar End-to-end thin-film silicon PV solutions Management Chairman and CEO: Tetsuro (Terry) Higashi President : Hiroshi Takenaka