User:Project Osprey/sandbox4

History of antioxidants

Trixylylphosphate
Trixylyl phosphate (TXP) is an aromatic phosphate ester historically used as a hydraulic fluid.

Thermosets example table

 * Polyester resin


 * Polyurethanes
 * Polyurea/polyurethane


 * Vulcanized rubber.

formaldehyde base


 * Bakelite, a phenol-formaldehyde
 * Urea-formaldehyde
 * Melamine resin
 * Benzoxazines, formed by the reaction of phenols, formaldehyde and primary amines
 * Duroplast


 * Diallyl-phthalate (DAP)
 * Epoxy resin
 * Epoxy novolac resins


 * Polyimides and Bismaleimides
 * Cyanate esters or polycyanurates
 * Furan resins
 * Silicone resins
 * Thiolyte,
 * Vinyl ester resins used for wet lay-up laminating, molding and fast setting industrial protection and repair materials.


 * Polyester resin fiberglass systems: sheet molding compounds and bulk molding compounds; filament winding; wet lay-up lamination; repair compounds and protective coatings.
 * Polyurethanes: insulating foams, mattresses, coatings, adhesives, car parts, print rollers, shoe soles, flooring, synthetic fibers, etc. Polyurethane polymers are formed by combining two bi- or higher functional monomers/oligomers.
 * Polyurea/polyurethane hybrids used for abrasion resistant waterproofing coatings.
 * Vulcanized rubber.
 * Bakelite, a phenol-formaldehyde resin used in electrical insulators and plasticware.
 * Duroplast, light but strong material, similar to Bakelite used for making car parts.
 * Urea-formaldehyde foam used in plywood, particleboard and medium-density fiberboard.
 * Melamine resin used on worktop surfaces.
 * Diallyl-phthalate (DAP) used in high temperature and mil-spec electrical connectors and other components. Usually glass filled.
 * Epoxy resin used as the matrix component in many fiber reinforced plastics such as glass-reinforced plastic and graphite-reinforced plastic; casting; electronics encapsulation; construction; protective coatings; adhesives; sealing and joining.
 * Epoxy novolac resins used for printed circuit boards, electrical encapsulation, adhesives and coatings for metal.
 * Benzoxazines, used alone or hybridised with epoxy and phenolic resins, for structural prepregs, liquid molding and film adhesives for composite construction, bonding and repair.
 * Polyimides and Bismaleimides used in printed circuit boards and in body parts of modern aircraft, aerospace composite structures, as a coating material and for glass reinforced pipes.
 * Cyanate esters or polycyanurates for electronics applications with need for dielectric properties and high glass temperature requirements in aerospace structural composite components.
 * Mold or mold runners (the black plastic part in integrated circuits or semiconductors).
 * Furan resins used in the manufacture of sustainable biocomposite construction, cements, adhesives, coatings and casting/foundry resins.
 * Silicone resins used for thermoset polymer matrix composites and as ceramic matrix composite precursors.
 * Thiolyte, an electrical insulating thermoset phenolic laminate material.
 * Vinyl ester resins used for wet lay-up laminating, molding and fast setting industrial protection and repair materials.