User:Rando717/sandbox

= Project 1 = All EPYC tables.

EPYC 7001 (Naples, Zen)
Common features of EPYC 7001 series CPUs:
 * Socket: SP3.
 * All the CPUs support ECC DDR4-2666 in octa-channel mode (7251 supports only DDR4-2400).
 * L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 128 PCIe 3.0 lanes.
 * Fabrication process: GlobalFoundries 14 nm.

EPYC 7002 (Rome, Zen2)
Common features of EPYC 7002 series CPUs:
 * Socket: SP3.
 * All the CPUs support ECC DDR4-3200 in octa-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 128 PCIe 4.0 lanes.
 * Fabrication process: TSMC 7 nm FinFET (GlobalFoundries 14 nm for the I/O Die).

EPYC 7003 (Milan, Zen3)
Common features of EPYC 7003 series CPUs:
 * Socket: SP3.
 * All the CPUs support ECC DDR4-3200 in octa-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 128 PCIe 4.0 lanes.
 * Fabrication process: TSMC 7 nm FinFET (GlobalFoundries 14 nm for the I/O Die).

EPYC 9004 (Genoa, Zen4/Zen4c)
Common features of EPYC 9004 series CPUs:
 * Socket: SP5.
 * All the CPUs support ECC DDR5-4800 in dodeca-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 1 MB per core.
 * All the CPUs support 128 PCIe 5.0 lanes.
 * Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O Die).

EPYC 8004 (Siena, Zen4c)
Common features of EPYC 8004 series CPUs:
 * Socket: SP6.
 * All the CPUs support ECC DDR5-4800 in hexa-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 1 MB per core.
 * All the CPUs support 96 PCIe 5.0 lanes.
 * Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O Die).

EPYC Embedded 3000 (Snowy Owl, Zen)
Common features of EPYC Embedded 3000 series CPUs:
 * Socket: SP4 (SP4r2 31xx and 32xx models).
 * All the CPUs support ECC DDR4-2666 in dual-channel mode (3201 supports only DDR4-2133 while 33xx and 34xx models support quad-channel mode).
 * L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 32 PCIe 3.0 lanes per CCD (max 64 lanes).
 * Fabrication process: GlobalFoundries 14 nm.

= Project 2 = All Ryzen Embedded tables.

Ryzen Embedded V1000 (Great Horned Owl, Zen)
Common features of Ryzen Embedded V1000 series CPUs:
 * Socket: FP5.
 * All the CPUs support ECC DDR4-2400 in dual-channel mode (V1807B and V17xxB models supports DDR4-3200).
 * L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 16 PCIe 3.0 lanes.
 * Integrated graphics: 5th generation Graphics Core Next (GCN).
 * Fabrication process: GlobalFoundries 14 nm.

Ryzen Embedded R1000 (Banded Kestrel, Zen)
Common features of Ryzen Embedded R1000 series CPUs:
 * Socket: FP5.
 * All the CPUs support ECC DDR4-2400 in dual-channel mode (R1102G supports only single-channel mode).
 * L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 8 PCIe 3.0 lanes (R1102G supports only 4 lanes).
 * Integrated graphics: 5th generation Graphics Core Next (GCN).
 * Fabrication process: GlobalFoundries 14 nm.

Ryzen Embedded V2000 (Grey Hawk, Zen2)
Common features of Ryzen Embedded V2000 series CPUs:
 * Socket: FP6.
 * All the CPUs support ECC DDR4-3200 in dual-channel mode or LPDDR4X-4266 in quad-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 20 PCIe 3.0 lanes.
 * Integrated graphics: 5th generation Graphics Core Next (GCN).
 * Fabrication process: TSMC 7 nm FinFET.

Ryzen Embedded R2000 (River Hawk, Zen+)
Common features of Ryzen Embedded R2000 series CPUs:
 * Socket: FP5.
 * All the CPUs support DDR4-2667 in dual-channel mode (R2312 supports only DDR4-2400 while R2544 supports DDR4-3200).
 * L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 16 PCIe 3.0 lanes (R2312 supports only 8 lanes).
 * Integrated graphics: 5th generation Graphics Core Next (GCN).
 * Fabrication process: GlobalFoundries 12 nm.

Ryzen Embedded V3000 (Zen3)
Common features of Ryzen Embedded V3000 series CPUs:
 * Socket: FP7 (FP7r2).
 * All the CPUs support ECC DDR5-4800 in dual-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 20 PCIe 4.0 lanes.
 * Fabrication process: TSMC 7 nm FinFET.

Ryzen Embedded 5000 Series (Zen3)
Common features of Ryzen Embedded 5000 series CPUs:
 * Socket: AM4.
 * All the CPUs support ECC DDR5-3200 in dual-channel mode.
 * L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
 * L2 cache: 512 KB per core.
 * All the CPUs support 24 PCIe 4.0 lanes.
 * Fabrication process: TSMC 7 nm FinFET (GlobalFoundries 14 nm for the I/O Die).

= Project 3 =