User:Tegel/Books/SMD2


 * Ball grid array
 * Integrated circuit
 * Dual in-line package
 * Surface-mount technology
 * Small-outline integrated circuit
 * Thin small-outline package
 * Shrink Small-Outline Package
 * Die (integrated circuit)
 * Printed circuit board
 * JEDEC
 * SMT placement equipment
 * Chip scale package
 * Wafer (electronics)
 * Reflow soldering
 * Solder
 * TSSOP
 * Solder paste
 * Screen-printing
 * Soldering
 * Electronic component
 * Wave soldering
 * Through-hole technology
 * Flip chip
 * Chip carrier
 * Flux (metallurgy)
 * Restriction of Hazardous Substances Directive
 * Tin
 * Lead
 * Whisker (metallurgy)
 * Electronics