User:Tomatarto/sandbox

Bumpgate
Bumpgate refers to a period of time roughly in-between 2006 and 2010 when graphics processing units manufactured around that time had a much higher than average failure rate in the field. This was due to a incorrect balance of properties for the die packaging material that lead to the solder bumps on the FCBGA to experience much larger amounts of thermal strain then normal. This inevitably lead to higher failure rates.