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Tag reliability
Generally, a RFID tag has an inlay, composed of three components, namely silicon (Si) chip, ACA (Anisotropic conductive adhesive) layer and flexible substrate (Al/PET), as shown in Fig.1(a). The chip is flip-chip assembled on the Al/PET flexible substrate through ACA hot-press process. After bonding process, the shear strength of the tag inlay can be measured using the bond tester. The shear strength test principle is based on the solder ball shear test standard, as shown in Fig.1(b). A rigid clamping device is used to fix one side of the substrate, and the vacuum plate is used to absorb the bottom of the sample. The blade is pushed horizontally from one side. The maximum shear force for each joint, which finally separates the chip from the substrate, is recorded, as shown in Fig.1(c).