User talk:ILoveMyComputer/temp

To estimate the number of integral die pieces of die size [S, mm2] that can be sliced out of a wafer of diameter [d, mm].

The gross die count [A] can be estimated by the following expression:

$$A_{gross} = d\pi\left (\frac{d}{4S} - \frac{1}{\sqrt{2S}} \right)$$

Take three GPUs for example: the RV770, the GT200 ans the GT206/GT200b.

For RV770, gross die count = $$A_{gross} = 300\pi\left (\frac{300}{4\times256} - \frac{1}{\sqrt{2\times256}} \right)\thickapprox 234$$

For GT206, gross die count = $$A_{gross} = 300\pi\left (\frac{300}{4\times484} - \frac{1}{\sqrt{2\times484}} \right)\thickapprox 115$$

For GT200, gross die count = $$A_{gross} = 300\pi\left (\frac{300}{4\times576} - \frac{1}{\sqrt{2\times576}} \right)\thickapprox 94$$

Note: All GPU dies are produced on a 300 mm wafer in this case, thus d = 300 mm, test circuits are not included in this calculation.