User talk:Mehdimazar

Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which can not be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects. The bonding technique have been exploited in a wide range of applications, from the production and repair of turbine engines in the airspace industry [1,2,3] to the atomic nuclear power plants [4,5] and the connection of circuit lines in the microelectronic industry [6,7]. The process differs from diffusion bonding in which diffusion occurs when a melting point depressant element(s) from an interlayer moves into lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of composition at the bond interface and the bonding temperature selects to enable this phase melts. The dissimilar interlayer melts at a lower temperature than the parent materials. Thus a thin layer of liquid spreads along the interface to form a joint at a lower temperature than the melting point of either of the parent materials. A reduction in bonding temperature leads to solidification of the melt, and this phase can subsequently be diffused away into the parent materials by holding at bonding temperature. In this technique it is needed to select a suitable interlayer by considering its wettability, flow characteristics, high stability to prevent reactions with the base materials, and the ability to form a composition having a remelt temperature higher than the bonding temperature. The joining technique dates back to ancient times [8,9,10] as for example the copper oxide painted as the interlayer covered with some tallow or glue to hold some gold balls on to a gold article were heated in a reducing flame to form an eutectic at the bond area.There are many theories on the kinetics of the bonding process; however the most common is the one divided the process into four main stages including dissolution of the interlayer, homogenization of the liquid, isothermal solidification and homogenization of the bond region [11,12].

 Fig.1. Sequences of transient liquid phase diffusion bonding.


 * [1] Duvall, D.S., Owczarski, W.A., Paulonis, D.F." TLP Bonding: a New Method for Joining Heat Resisting Alloys". Welding Journal, 53(4)(1974), 203-214.
 * [2] Cain, S.R., Wilcox, J.R., Venkatraman, R."A diffusional model for transient liquid phase bonding". Acta Materialia, 45 (1997), 701-707.
 * [3] Zhou, Y., Gale, W.F., North, T.H. " Modelling of transient liquid phase bonding". International Materials Review, 40(5) (1995), 181-196.
 * [4] Maza Atabaki, M." Partial transient liquid phase diffusion bonding of Zircaloy-4 to stabilized austenitic stainless steel 321 using active titanium filler metal". Journal of Manufacturing Science and Engineering, 133(5) (2011).
 * [5] Mazar Atabaki, M. "Microstructural evolution in the partial transient liquid phase diffusion bonding of Zircaloy-4 to stainless steel 321 using active titanium filler metal". Journal of Nuclear Materials, 406(3) (2010), 330-344.
 * [6] Hou, M.M., Eager, Thomas W. " Low temperature transient liquid phase (LTTLP) bonding for Au/Cu and Cu/Cu interconnections ". Journal of Electron. Package, 114(4) (1992), 443-448.
 * [7] Fischer, David S., " Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems". PhD Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.
 * [8] Hawthorne, J.G., Smith, C.S. " On divers arts, the treatise of theophilus". Chicago: University of Chicago Press. (1963), 216.
 * [9] Smith, C.S., " A search for structure". Cambrige, Mass: MIT Press. (1981), 92-94.
 * [10] Littledale, H.A.P. Brit. Patent No. 415,181 (1933).
 * [11] MacDonald W.D., and Eager, T.W. Transient liquid phase bonding. Annual Review of Materials Science. 22 (1) (1992), 23-46.
 * [12] Tuah-poku, I., Dollar, M., Massalski, T.B. " A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metallurgical Transactions A". 19(A) (1988), 675-686.

Transient liquid phase diffusion bonding
Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which can not be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects. The bonding technique have been exploited in a wide range of applications, from the production and repair of turbine engines in the airspace industry [1,2,3] to the atomic nuclear power plants [4,5] and the connection of circuit lines in the microelectronic industry [6,7]. The process differs from diffusion bonding in which diffusion occurs when a melting point depressant element(s) from an interlayer moves into lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of composition at the bond interface and the bonding temperature selects to enable this phase melts. The dissimilar interlayer melts at a lower temperature than the parent materials. Thus a thin layer of liquid spreads along the interface to form a joint at a lower temperature than the melting point of either of the parent materials. A reduction in bonding temperature leads to solidification of the melt, and this phase can subsequently be diffused away into the parent materials by holding at bonding temperature. In this technique it is needed to select a suitable interlayer by considering its wettability, flow characteristics, high stability to prevent reactions with the base materials, and the ability to form a composition having a remelt temperature higher than the bonding temperature. The joining technique dates back to ancient times [8,9,10] as for example the copper oxide painted as the interlayer covered with some tallow or glue to hold some gold balls on to a gold article were heated in a reducing flame to form an eutectic at the bond area.There are many theories on the kinetics of the bonding process; however the most common is the one divided the process into four main stages including dissolution of the interlayer, homogenization of the liquid, isothermal solidification and homogenization of the bond region [11,12].

 Fig.1. Sequences of transient liquid phase diffusion bonding.


 * [1] Duvall, D.S., Owczarski, W.A., Paulonis, D.F." TLP Bonding: a New Method for Joining Heat Resisting Alloys". Welding Journal, 53(4)(1974), 203-214.
 * [2] Cain, S.R., Wilcox, J.R., Venkatraman, R."A diffusional model for transient liquid phase bonding". Acta Materialia, 45 (1997), 701-707.
 * [3] Zhou, Y., Gale, W.F., North, T.H. " Modelling of transient liquid phase bonding". International Materials Review, 40(5) (1995), 181-196.
 * [4] Maza Atabaki, M." Partial transient liquid phase diffusion bonding of Zircaloy-4 to stabilized austenitic stainless steel 321 using active titanium filler metal". Journal of Manufacturing Science and Engineering, 133(5) (2011).
 * [5] Mazar Atabaki, M. "Microstructural evolution in the partial transient liquid phase diffusion bonding of Zircaloy-4 to stainless steel 321 using active titanium filler metal". Journal of Nuclear Materials, 406(3) (2010), 330-344.
 * [6] Hou, M.M., Eager, Thomas W. " Low temperature transient liquid phase (LTTLP) bonding for Au/Cu and Cu/Cu interconnections ". Journal of Electron. Package, 114(4) (1992), 443-448.
 * [7] Fischer, David S., " Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems". PhD Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.
 * [8] Hawthorne, J.G., Smith, C.S. " On divers arts, the treatise of theophilus". Chicago: University of Chicago Press. (1963), 216.
 * [9] Smith, C.S., " A search for structure". Cambrige, Mass: MIT Press. (1981), 92-94.
 * [10] Littledale, H.A.P. Brit. Patent No. 415,181 (1933).
 * [11] MacDonald W.D., and Eager, T.W. Transient liquid phase bonding. Annual Review of Materials Science. 22 (1) (1992), 23-46.
 * [12] Tuah-poku, I., Dollar, M., Massalski, T.B. " A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metallurgical Transactions A". 19(A) (1988), 675-686.

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