Paul William Coteus
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Paul William Coteusis an electrical engineer at IBM's T.J. Watson Research Center in Yorktown Heights, New York.
Coteus was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013[1] for his contributions to packaging for high performance computing systems.
References[edit]
- ^ "The Institute" (PDF). IEEE. Retrieved January 1, 2020.
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