Mini Small Outline Package

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.

Application
Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.

Physical properties
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions and 3mm × 4mm for the 12 and 16 pin version. The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.

Synonyms

 * μMAX or micro max - Maxim name for the msop package.
 * μMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad.
 * MSE - Linear Technology name for the msop package with exposed pad.