Talk:IBM ROMP

Prototyping
I read an online article some years ago that said the ROMP was initially prototyped using discrete components, then once it was functionally stable, the circuitry was converted to a single silicon die.

Try that with a present day microchip.

Actually, there were two prototypes. One was a functional equivalent, for software development. The second was node-equivalent, with a net for every gate output on the chip, for verification. The latter took around 16 boards of 384 modules each. —Preceding unsigned comment added by 192.91.66.189 (talk) 17:54, 27 April 2011 (UTC)