List of Intel Atom processors

Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.

For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

"Diamondville" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
 * Transistors: 47 million
 * Die size: 25.96 mm2 (3.27 × 7.94)
 * Package size: 22 mm × 22 mm

"Pineview" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
 * Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller
 * Transistors: 123 million (single-core), 176 million (dual-core)
 * Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core)
 * Package size: 22 mm × 22 mm

"Cedarview" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (except D2500)
 * Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
 * Package size: 22 mm × 22 mm

"Diamondville" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
 * Transistors: 47 million
 * Die size: 26 mm2
 * Package size: 22 mm × 22 mm

"Pineview" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
 * Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB
 * Transistors: 123 million (single-core), 176 million (dual-core)
 * Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core)
 * Package size: 22 mm × 22 mm

"Cedarview" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
 * Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
 * Package size: 22 × 22 mm

"Silverthorne" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
 * Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
 * Model Z515 supports Intel Burst Performance Technology
 * Uses the Poulsbo chipset.
 * Transistors: 47 million
 * Die size: 26 mm2
 * Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number)

"Lincroft" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
 * GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.
 * Transistors: 140 million
 * Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
 * Package size: 13.8 mm × 13.8 × 1.0 mm
 * Steppings: C0

"Penwell" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading.
 * Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller
 * Package size: 12 mm × 12 × 1.0 mm
 * Transistors: 140 million
 * Die size: 65.2526 mm2 (7.34 mm x 8.89 mm)

"Merrifield" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT).
 * Z3480 also supports Intel Wireless Display.
 * Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
 * Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G


 * Package size: 12 mm × 12 × 1.0 mm

"Moorefield" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display.
 * GPU (PowerVR G6430) and memory controller are integrated onto the processor die
 * Package size: 14 mm × 14 × 1.0 mm

"SoFIA" (28 nm)

 * SoFIA (smart or feature phone with Intel architecture)
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs)
 * GPU (ARM Mali) and memory controller are integrated onto the processor die
 * Package size: 34 × 40 mm
 * SoFIA 3G SoC with Silvermont CPU
 * Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)
 * SoFIA 3G–R SoC with Silvermont CPU
 * Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)
 * SoFIA LTE (W) with Airmont CPU (Announced, but never launched)
 * Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)

"Lincroft" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
 * GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die
 * Transistors: 140 million
 * Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
 * Package size: 13.8 mm × 13.8 × 1.0 mm
 * Steppings: C0

"Cloverview" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT).
 * GPU and memory controller are integrated onto the processor die
 * Package size: 13.8 mm × 13.8 × 1.0 mm
 * Steppings:B1, C0

No official TDP available. For power data see page 129–130.

"Bay Trail-T" (22 nm)
Type 4 SoC: Type 3 SoC:
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI, TXT/TXE
 * Package size: 17 mm × 17 × 1.0 mm
 * DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
 * Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
 * Integrated Intel HD Graphics (Gen7) GPU
 * One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
 * One USB 2.0 controller supporting four ports
 * Integrated LPE audio controller
 * Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video
 * Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
 * Serial I/O supporting SPI, UART (serial port), I2C or PWM
 * DDR3L/L-RS single-channel memory controller supporting up to 2 GB
 * Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4)
 * Integrated Intel HD Graphics (Gen7) GPU
 * One USB controller supporting two USB 2.0 ports
 * Integrated LPE audio controller
 * Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
 * Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
 * Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Cherry Trail-T" (14 nm)
Type 4 SoC: Type 3 SoC:
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPID AES-NI., TXT/TXE
 * Package size: 17 mm × 17 × 1.0 mm
 * LPDDR3 dual-channel memory controller supporting up to 8 GB
 * PCI Express 2.0 controller with 2 lanes
 * Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
 * Integrated Intel HD Graphics (Gen8) GPU
 * One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
 * One USB xDCI controller supporting one USB 3.0 port
 * Integrated LPE audio controller
 * Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
 * Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
 * Serial I/O supporting SPI, UART (serial port), I2C or PWM
 * DDR3L/L-RS single-channel memory controller supporting up to 2 GB
 * PCI Express 2.0 controller with 1 lane
 * Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
 * Integrated Intel HD Graphics (Gen8) GPU
 * One USB controller supporting three USB 2.0 ports and two HSIC ports
 * Integrated LPE audio controller
 * Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
 * Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
 * Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Tunnel Creek" (45 nm)

 * CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x.
 * Package size: 22 mm × 22 mm
 * Steppings: B0
 * Temperature range: for (E620, E640, E660, E680): 0 °C to +70 °C, for (E620T, E640T, E660T, E680T): -40 °C to +85 °C.
 * DDR2 single-channel memory controller supporting up to 2 GB
 * PCI Express 1.0a controller with 4 lanes
 * Display controller with LVDS and serial DVO ports
 * Integrated GMA600 (PowerVR) GPU
 * Integrated HD audio controller
 * Serial I/O supporting SPI

"Stellarton" (45 nm)

 * "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA)
 * CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x
 * Package size: 37.5 mm × 37.5 mm
 * Steppings: B0
 * TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
 * Temperature range: for (E625C, E645C, E665C): 0 °C to +70 °C, for (E625CT, E645CT, E665CT): -40 °C to +85 °C.
 * DDR2 single-channel memory controller supporting up to 2 GB
 * PCI Express 1.0a controller with 4 lanes
 * Display controller with LVDS and serial DVO ports
 * Integrated GMA600 (PowerVR) GPU
 * Integrated HD audio controller
 * Serial I/O supporting SPI

"Bay Trail-I" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE
 * Package size: 25 mm × 27 mm
 * DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
 * Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
 * Integrated Intel HD Graphics (Gen7) GPU
 * PCI Express 2.0 controller with four lanes and four root ports
 * Two SATA-300 ports
 * One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
 * One USB 2.0 controller supporting four ports
 * Integrated LPE and HD audio controllers
 * Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video
 * Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
 * Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Braswell" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 27 mm

"Apollo Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
 * Package size: 24 mm × 31 mm
 * DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
 * Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
 * Integrated Intel HD Graphics (Gen9) GPU
 * PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
 * Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
 * Two USB 2.0 ports
 * Two SATA-600 ports (one multiplexed with USB 3.0)
 * Integrated HD audio controller
 * Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
 * Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
 * Serial I/O supporting SPI, HSUART (serial port) and I2C

"Elkhart Lake" (10 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
 * GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI.
 * SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
 * Package size: 35 mm × 24 mm

Server SoCs
All Atom server processors include ECC support.

"Centerton" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

"Briarwood" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

"Avoton" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
 * Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
 * Quad-core SoC peripherals include 4 × USB 2.0, 2 (C2530) or 6 (C2550) × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
 * C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
 * C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
 * Package size: 34 mm × 28 mm
 * Die size: 107 mm2

"Rangeley" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
 * All models except C2x38 support Intel QuickAssist Technology (cryptography accelerator)
 * SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated GbE LAN (2 for C2316), 2 × UART, and 8-16 lanes of PCI Express 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations.
 * Package size: 34 mm × 28 mm

"Denverton" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 only), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC memory.
 * SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE (C3538 and up) LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.
 * Package size: 34 mm × 28 mm

"Snow Ridge" (10 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
 * Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
 * SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.
 * Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)
 * P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications (extended temperature range).
 * Package size: 47.5 mm × 47.5 mm

"Parker Ridge" (10 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
 * SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN (except 51xx model numbers), 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.
 * Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)
 * Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.
 * Package size: 47.5 mm × 47.5 mm

"Sodaville" (45 nm)

 * Package size: 27 mm × 27 mm
 * GPU (based on the PowerVR SGX535 from Imagination Technologies)

"Groveland" (45 nm)
CE4200
 * Package size: ?? mm × ?? mm
 * 2 × 32-bit memory channels, up to DDR2-800
 * GPU (based on the PowerVR SGX535 from Imagination Technologies)

"Berryville" (32 nm)

 * Package size: ?? mm × ?? mm
 * GPU for 3D (based on the PowerVR SGX545 from Imagination Technologies)
 * GPU for 2D (GC300 from Vivante)