List of Intel Celeron processors

The Celeron was a family of microprocessors from Intel targeted at the low-end consumer market. CPUs in the Celeron brand have used designs from sixth- to eighth-generation CPU microarchitectures. It was replaced by the Intel Processor brand in 2023.

"Covington" (250 nm)

 * All models support: MMX
 * Steppings: A0, A1, B0

"Mendocino" (250 nm)

 * All models support: MMX
 * L2 cache is on-die, running at full CPU speed

"Coppermine-128" (180 nm)

 * All models support: MMX, SSE

"Tualatin-256" (130 nm)

 * All models support: MMX, SSE
 * Family 6 model 11

"Willamette-128" (180 nm)

 * Family 15 model 1
 * All models support: MMX, SSE, SSE2
 * Steppings: E0

"Northwood-128" (130 nm)

 * Family 15 model 2
 * All models support: MMX, SSE, SSE2
 * Steppings: C0, C1, D0, D1, D4, DD

"Prescott-256" (90 nm)

 * All models support: MMX, SSE, SSE2, SSE3
 * Intel 64: supported by 3x1, 3x6, 355
 * XD bit (an NX bit implementation): supported by 3x0J, 3x5J, and all Intel64-compatible models
 * Steppings: C0, D0, E0, G0 & G1

"Cedar Mill-512" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: C1, D0

"Conroe-L" (65 nm)

 * Chip harvests from Allendale-1M with one core disabled
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: A1

"Conroe-CL" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x
 * Steppings: ?

"Allendale" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation)
 * Steppings: M0

"Wolfdale-3M" (45 nm)

 * Based on Core microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x
 * Steppings: R0
 * Die size: 82 mm2

"Clarkdale" (MCP, 32 nm)

 * Based on Westmere microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Contains 45 nm "Ironlake" GPU.

"Sandy Bridge" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Celeron G440 does not support Enhanced Intel SpeedStep Technology (EIST), this is a special case as the processor uses the minimum available multiplier (16x). The Celeron G440 also does not support Hyper-threading.
 * Celeron G460, G465 and G470 support Hyper-threading.
 * HD Graphics (Sandy Bridge) contain 6 EUs like the HD Graphics 2000, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, and it does not support 3D Video.
 * Transistors: 624 or 504 million
 * Die size: 149 or 131 mm2

"Ivy Bridge" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache, ECC Memory.
 * HD Graphics (Ivy Bridge) contain 6 EUs as well as HD Graphics 2500, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, Intel Insider.

"Bay Trail-D" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, Intel VT-x.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.0 and OpenCL 1.1 (on Windows). J1800 and J1900 support Intel Quick Sync Video.
 * Package size: 25 mm × 27 mm

"Braswell" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.4, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 27 mm

"Haswell-DT" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Haswell Celerons support Quick Sync.
 * Haswell-R Celerons G1840, G1850, and G1840T also support Intel Wireless Display.
 * Transistors: 1.4 billion
 * Die size: 177 mm2
 * All models support ECC memory.

"Skylake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache.
 * All models support up to DDR3-1600 or DDR4-2133 memory.
 * All models support ECC memory.
 * Transistors: TBD
 * Die size: TBD

"Apollo Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
 * Package size: 24 mm × 31 mm
 * DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB
 * Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
 * Integrated Intel HD Graphics (Gen9) GPU
 * PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
 * Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
 * Two USB 2.0 ports
 * Two SATA-600 ports (one multiplexed with USB 3.0)
 * Integrated HD audio controller
 * Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
 * Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
 * Serial I/O supporting SPI, HSUART (serial port) and I2C

"Gemini Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel SGX, Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 12 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 24 mm

"Gemini Lake Refresh" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel SGX, Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 12 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 24 mm

"Kaby Lake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache.
 * All models support up to DDR3-1600 or DDR4-2400 memory (DDR4-2133 for embedded models).
 * All models support ECC memory.
 * Transistors: TBD
 * Die size: TBD

"Alder Lake" (Intel 7)

 * All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, DL Boost, GNA 3.0, and Optane memory.
 * All models support up to DDR5-4800 or DDR4-3200 memory, and 16 lanes of PCI Express 5.0 + 4 lanes of PCIe 4.0.

"Mendocino" (250 nm)

 * All models support: MMX

"Coppermine-128" (180 nm)

 * All models support: MMX, SSE

"Coppermine T" (180 nm)

 * All models support: MMX, SSE

"Tualatin-256" (130 nm)

 * All models support: MMX, SSE

"Northwood-256" (130 nm)

 * All models support: MMX, SSE, SSE2

"Banias-512" (130 nm)

 * All models support: MMX, SSE, SSE2

"Dothan-1024" (90 nm)

 * All models support: MMX, SSE, SSE2
 * XD bit (an NX bit implementation): supported by 360J, 370, 380, 390, 383

"Dothan-512" (90 nm)

 * All models support: MMX, SSE, SSE2, XD bit (an NX bit implementation)

"Yonah-512" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, XD bit (an NX bit implementation)
 * Steppings: C0

"Yonah-1024" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, XD bit (an NX bit implementation)
 * Steppings: C0, D0

"Sossaman" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel VT-x
 * Die size: 90.3 mm2
 * Steppings: D0

=
"Merom", "Merom-L" (standard-voltage, 65 nm) =====


 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: B2, E1, G0, G2, A1

"Merom-2M" (standard-voltage, 65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: M0

"Merom-L" (ultra-low-voltage, 65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: A1, M1

"Penryn-3M" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Package size: 35 mm2 (standard voltage), 22 mm2 (low voltage)
 * Steppings: R0
 * Die size: 107 mm2


 * Note that 900 has also been used for three earlier models of Intel Celeron microprocessors with different microarchitectures.
 * Intel initially listed the Celeron 900 as Dual-Core and with Virtualization Technology in its Processorfinder and ARK databases, which caused confusion among customers.
 * ULV 723 possibly supports EIST, but Intel's web site is inconsistent about this.

"Merom-2M" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: M0


 * Note that Intel has also released Core Solo microprocessors with the model numbers T1400, T1500, and T1600.
 * T1700 possibly supports EIST, but Intel's web site is inconsistent about this.

"Penryn-3M" (45 nm)

 * Based on Core microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation)
 * Steppings: R0


 * Note that the Pentium T3x00 processors have a similar number but are based on the older Merom-2M chips.
 * Note that the Pentium SU2xxx processors have a similar number but are single-core processors.

"Arrandale" (MCP, 32 nm)

 * Based on Westmere microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache
 * P4505 and U3405 support memory ECC RAM and PCIe bifurcation.
 * FSB has been replaced with DMI.
 * Contains 45 nm "Ironlake" GPU.
 * Die size: 81 mm2
 * Graphics and Integrated Memory Controller die size: 114 mm2
 * Steppings: C2, K0

"Sandy Bridge" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * (Embedded) Celeron B810E, Celeron B847E does not support XD bit(Execute Disable Bit), nor SSE4.1 and SSE4.2 instructions.
 * (Embedded) Celeron B810E, Celeron B847E has support for ECC memory.
 * HD Graphics (Sandy Bridge) contain 6 EUs as well as HD Graphics 2000, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, and it doesn't support 3D Video.
 * Transistors: 624 or 504 million
 * Die size: 149 or 131 mm2

"Ivy Bridge" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * HD Graphics (Ivy Bridge) contain 6 EUs as well as HD Graphics 2500, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, Intel Insider.
 * Embedded models have support for ECC memory.

"Haswell-MB" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * 2970M supports Intel Quick Sync Video.

"Haswell-ULT" (SiP, 22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * 2957U and 2981U also support Intel Wireless Display and Intel Quick Sync Video.
 * Transistors: 1.3 billion
 * Die size: 181 mm2

"Haswell-ULX" (SiP, 22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Transistors: 1.3 billion
 * Die size: 181 mm2
 * GPU supports Intel Quick Sync Video.

"Haswell-H" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Transistors: 1.3 billion
 * Die size: 181 mm2
 * Embedded models support ECC memory
 * GPU doesn't support Intel Quick Sync Video.

"Broadwell-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Smart Cache, Intel Wireless Display, and configurable TDP (cTDP) down

"Bay Trail-M" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.0 and OpenCL 1.1. N2807, N2808, N2830, N2840, N2930 and N2940 support Intel Quick Sync Video.
 * Package size: 25 mm × 27 mm

"Braswell" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 27 mm

"Skylake-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, Intel Wireless Display, and configurable TDP (cTDP) down

"Apollo Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Skylake Intel HD Graphics, with 12 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 24 mm × 31 mm

"Gemini Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel SGX, Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 12 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 24 mm

"Gemini Lake Refresh" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel SGX, Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 12 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 24 mm

"Kaby Lake-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down

"Kaby Lake-Y" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down

"Kaby Lake Refresh" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

"Tiger Lake-UP3" (10 nm SuperFin)

 * All models support: SSE4.1, SSE4.2, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4.

"Jasper Lake" (10 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SHA Extensions, Intel SGX, SMAP/SMEP
 * Package size: 35 mm x 24 mm
 * DDR4/LPDDR4 dual-channel memory controller supporting up to 16 GB
 * Display controller with 1 MIPI DSI 1.2 port and 3 DDI ports (eDP 1.4b, MIPI DSI 1.2, DP 1.4a, or HDMI 2.0b)
 * Integrated Intel HD Graphics (Gen11) GPU
 * PCI Express 3.0 controller supporting 8 lanes (multiplexed); 4 lanes available externally
 * Two USB 3.2 2x1 ports (a.k.a. USB 3.1)
 * Four USB 3.2 1x1 ports (a.k.a. USB 3.0)
 * Eight USB 2.0 ports
 * Two SATA-600 ports
 * Integrated HD audio controller
 * Integrated image signal processor supporting four cameras (three concurrent)
 * Integrated memory card reader supporting SDIO 3.0 and eMMC 5.1
 * Serial I/O supporting SPI, HSUART (serial port) and I2C
 * Integrated CNVi with Wi-Fi 6 (IEEE 802.11ax 1x1 and 2x2) and Bluetooth 5.x (using UART/I2S/USB2)

"Alder Lake-U" (Intel 7)

 * All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, AES-NI, IPU6, TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 * Support 20 lanes (UP3) or 14 lanes (UP4) of PCI Express 4.0/3.0.
 * All models support up to LPDDR5-5200 or LPDDR4X-4266 memory
 * Standard power models also support up to DDR5-4800 or DDR4-3200 memory.

"Jasper Forest" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, HyperThreading, Smart Cache, ECC memory.
 * Single-Core version of Xeon C3500-Series

"Gladden" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, EPT, Hyper-threading, Smart Cache, ECC memory.
 * Transistors:
 * Die size:

"Elkhart Lake" (10 nm SuperFin)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
 * GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI.
 * SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
 * Package size: 35 mm × 24 mm

"Tiger Lake-H" (10 nm SuperFin)

 * All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4.

"Alder Lake-U" (Intel 7)

 * All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, AES-NI, IPU6, TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 * Support 20 lanes (UP3) of PCI Express 4.0/3.0.
 * All models support up to LPDDR5-5200 or LPDDR4X-4266 memory
 * Standard power models also support up to DDR5-4800 or DDR4-3200 memory.