List of Intel Core processors



The following is a list of Intel Core processors. This includes the original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as Core 2 (Solo/Duo/Quad/Extreme), Core i3, Core i5, Core i7, Core i9, Core M (m3/m5/m7), Core 3, Core 5 and Core 7 branded processors.

"Allendale" (65 nm, 800 MT/s) 

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 * Die size: 111 mm2
 * Steppings: L2, M0, G0

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s) 

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 * All models support: Intel VT-x
 * Die size: 143 mm2
 * Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 * All models support: Intel VT-x
 * All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
 * Die size: 143 mm2
 * Transistor count: 291 million
 * Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Die size: 111 mm2 (Conroe)
 * Steppings: ?

"Conroe XE" (65 nm)
These models feature an unlocked clock multiplier
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Die size: 143 mm2
 * Steppings: B1, B2
 * The X6900 was never publicly released.

"Kentsfield" (65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 * Die size: 2 ×143 mm2
 * Steppings: B3, G0

"Kentsfield XE" (65 nm)
These models feature an unlocked clock multiplier
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 * Die size: 2 ×143 mm2
 * Steppings: B3, G0

"Wolfdale-3M" (45 nm, 1066 MT/s)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 * Die size: 82 mm2
 * Transistor Count: 230 million
 * Steppings: M0, R0
 * Models with a part number ending in "ML" instead of "M" support Intel VT-x

"Wolfdale" (45 nm, 1333 MT/s)

 * All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x, Intel VT-d , Trusted Execution Technology (TXT)
 * Die size: 107 mm2
 * Transistor Count: 410 million
 * Steppings: C0, E0

Note: The E8190 and E8290 do not support Intel VT-d.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d , Trusted Execution Technology (TXT) 
 * Die size: 2 × 82 mm2
 * Steppings: M0, M1, R0
 * All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
 * Die size: 2 × 107 mm2
 * Steppings: C0, C1, E0

"Yorkfield XE" (45 nm)

 * These models feature an unlocked clock multiplier
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 * I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
 * Intel VT-d supported by: QX9650
 * Die size: 2 × 107 mm2
 * Steppings: C0, C1, E0
 * The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

Lynnfield
Common features:
 * Socket: LGA 1156.
 * All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 45 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.

Bloomfield
Common features:
 * Socket: LGA 1366.
 * All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
 * PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
 * All CPUs feature a QPI bus to the chipset (northbridge).
 * Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 45 nm.
 * Extreme Edition processors have an unlocked multiplier and can be overclocked.

Clarkdale 
Common features:
 * Socket: LGA 1156.
 * All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.

Gulftown
Common features:
 * Socket: LGA 1366.
 * All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
 * PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
 * All CPUs feature a QPI bus to the chipset (northbridge).
 * Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.
 * X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (2nd gen)
==== Sandy Bridge-DT    ====

Common features:
 * Socket: LGA 1155.
 * All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i3-2120, i5-2400, and i7-2600 are available as embedded processors.
 * The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Core i (3rd gen)
==== Ivy Bridge-DT    ====

Common features:
 * Socket: LGA 1155.
 * All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Sandy Bridge-E
Common features:
 * Socket: LGA 2011.
 * All the CPUs support quad-channel DDR3-1600 RAM.
 * All CPU models provide 40 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.
 * K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (4th gen)
==== Haswell-DT<span class="anchor" id="&quot;Haswell-DT&quot; (22 nm)"> <span class="anchor" id="&quot;Haswell-DT&quot; (dual-core, 22 nm)"> <span class="anchor" id="&quot;Haswell-DT&quot; (quad-core, 22 nm, 4th generation)"> <span class="anchor" id="Haswell-DT (quad-core, 22 nm)"> <span class="anchor" id="&quot;Haswell-DT&quot; (quad-core, 22 nm)"> ====

Common features:
 * Socket: LGA 1150.
 * All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Haswell-H<span class="anchor" id="&quot;Haswell-H&quot; (MCP, quad-core, 22 nm)"> <span class="anchor" id="Haswell-H (MCP, quad-core, 22 nm)">
Common features:
 * Socket: BGA 1364 (soldered).
 * All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
 * Fabrication process: 22 nm.

Ivy Bridge-E<span class="anchor" id="&quot;Ivy Bridge-E&quot; (22 nm)">
Common features:
 * Socket: LGA 2011.
 * All the CPUs support quad-channel DDR3-1866 RAM.
 * All CPU models provide 40 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (5th gen)
==== Broadwell-H<span class="anchor" id="&quot;Broadwell-H&quot; (quad-core, 14 nm)"> <span class="anchor" id="Broadwell-H (quad-core, 14 nm)"> <span class="anchor" id="&quot;Broadwell-DT&quot; (quad-core, 14 nm)"> ====

Common features:
 * Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
 * All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
 * Fabrication process: 14 nm.

Haswell-E<span class="anchor" id="&quot;Haswell-E&quot; (22 nm)">
Common features:
 * Socket: LGA 2011-3.
 * All the CPUs support quad-channel DDR4-2133 RAM.
 * i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Skylake-S<span class="anchor" id="&quot;Skylake-S&quot; (14 nm)"> <span class="anchor" id="&quot;Skylake-S&quot; (quad-core, 14 nm)"> <span class="anchor" id="Skylake-S (quad-core, 14 nm)">
Common features:
 * Socket: LGA 1151.
 * All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.

Skylake-H<span class="anchor" id="&quot;Skylake-H&quot; (quad-core, 14 nm)"> <span class="anchor" id="Skylake-H (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1440 (soldered).
 * All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
 * Fabrication process: 14 nm.

Broadwell-E<span class="anchor" id="&quot;Broadwell-E&quot; (14 nm)">
Common features:
 * Socket: LGA 2011-3.
 * All the CPUs support quad-channel DDR4-2400 RAM.
 * i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Kaby Lake-S<span class="anchor" id="&quot;Kaby Lake-S&quot; (14 nm)">
Common features:
 * Socket: LGA 1151.
 * All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.

Skylake-X<span class="anchor" id="&quot;Skylake-X&quot; (14 nm)"> <span class="anchor" id="Skylake-X (14 nm, 7th generation)">
Common features:
 * Socket: LGA 2066.
 * All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
 * i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Kaby Lake-X<span class="anchor" id="&quot;Kaby Lake-X&quot; (14 nm)">
Common features:
 * Socket: LGA 2066.
 * All the CPUs support dual-channel DDR4-2666 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * X-suffix processors have an unlocked multiplier and can be overclocked.

Coffee Lake-S<span class="anchor" id="&quot;Coffee Lake-S&quot; (14 nm) (9th gen is Coffee Lake-R)"> <span class="anchor" id="&quot;Coffee Lake-S&quot; (14 nm)">
Common features:
 * Socket: LGA 1151-2.
 * All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.

Coffee Lake-R<span class="anchor" id="Coffee Lake-S Refresh (14 nm, 9th generation)">
Common features:
 * Socket: LGA 1151-2.
 * All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9-9900KS has all-core boost clock of 5.0 GHz.

Skylake-X (9xxx)
Common features:
 * Socket: LGA 2066.
 * All the CPUs support quad-channel DDR4-2666 RAM.
 * All CPU models provide 44 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Comet Lake-S<span class="anchor" id="&quot;Comet Lake-S&quot; (14 nm)"> <span class="anchor" id="Comet Lake-S (14 nm, 10th generation)">
Common features:
 * Socket: LGA 1200.
 * All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Comet Lake-S (refresh)
Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:
 * Socket: LGA 1200.
 * All the CPUs support dual-channel DDR4-2666 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * All models support Turbo Boost 2.0.

Cascade Lake-X (10xxx)<span class="anchor" id="Cascade Lake-X (14 nm, enthusiast)">
Common features:
 * Socket: LGA 2066.
 * All the CPUs support quad-channel DDR4-2933 RAM.
 * All CPU models provide 48 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Rocket Lake-S<span class="anchor" id="&quot;Rocket Lake-S&quot; (14 nm)"> <span class="anchor" id="Rocket Lake-S (14 nm, 11th generation)">
Common features:
 * Socket: LGA 1200.
 * All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
 * All CPU models provide 20 lanes of PCIe 4.0.
 * All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 512 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Tiger Lake-B<span class="anchor" id="&quot;Tiger Lake-B&quot; (10 nm SuperFin)">
Common features:
 * Socket: BGA 1787 (soldered).
 * All the CPUs support dual-channel DDR4-3200 RAM.
 * All CPU models provide 20 lanes of PCIe 4.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * These CPUs were sold to OEMs only.

Alder Lake-S<span class="anchor" id="&quot;Alder Lake&quot; (Intel 7)"> <span class="anchor" id="&quot;Alder Lake-S&quot; (Intel 7)"> <span class="anchor" id="Alder Lake (Intel 7, 12th generation)">
Common features:
 * Socket: LGA 1700.
 * All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
 * All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
 * Fabrication process: Intel 7.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (13th gen)
==== Raptor Lake-S<span class="anchor" id="&quot;Raptor Lake&quot; (Intel 7)"> <span class="anchor" id="&quot;Raptor Lake-S&quot; (Intel 7)"> <span class="anchor" id="Raptor Lake (Intel 7, 13th/14th generation)"> ====

Common features:
 * Socket: LGA 1700.
 * All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
 * All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
 * E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Raptor Lake-S Refresh
Common features:
 * Socket: LGA 1700.
 * All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
 * All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * K-suffix processors have an unlocked multiplier and can be overclocked.
 * i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core
==== Yonah<span class="anchor" id="&quot;Yonah&quot;"> <span class="anchor" id="&quot;Yonah&quot; (65 nm)"> <span class="anchor" id="&quot;Yonah&quot; (low-voltage, 65 nm)"> <span class="anchor" id="&quot;Yonah&quot; (ultra-low-voltage, 65 nm)"> ====

"Merom-L" (65 nm) <span class="anchor" id="&quot;Merom-L&quot; (ultra-low-voltage, 65 nm)">

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Die size: 81 mm2
 * Steppings: A1

"Merom", "Merom-2M" (standard-voltage, 65 nm) <span class="anchor" id="&quot;Merom-2M&quot; (standard-voltage, 65 nm)"> <span class="anchor" id="&quot;Merom&quot; (standard-voltage, 65 nm)">

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 * Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
 * Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
 * Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
 * Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
 * Die size: 143 mm2 (Merom), 111 mm2 (Merom-2M)
 * Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
 * All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
 * Die size: 143 mm2
 * Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 * Die size: 111 mm2
 * Steppings: L2, M0

"Merom XE" (65 nm) <span class="anchor" id="&quot;Merom XE&quot; (standard-voltage, 65 nm)">
These models feature an unlocked clock multiplier
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
 * Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
 * Die size: 143 mm2
 * Steppings: E1, G0

"Penryn-L" (45 nm) <span class="anchor" id="&quot;Penryn-L&quot; (ultra-low-voltage, 45 nm, Small Form Factor)">

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 * Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
 * Die size: 82 mm2
 * 228 million transistors
 * Package size: 22 mm × 22 mm
 * Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm)

 * Die size: 107 mm2
 * The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
 * Steppings: C0, E0

==== "Penryn", "Penryn-3M" (standard-voltage, 45 nm) <span class="anchor" id="&quot;Penryn-2M&quot; (standard-voltage, 45 nm)"> <span class="anchor" id="&quot;Penryn-3M&quot; (standard-voltage, 45 nm)"> <span class="anchor" id="&quot;Penryn&quot; (standard-voltage, 45 nm)"> ====

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
 * T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
 * All T9xxx models support Trusted Execution Technology (TXT)
 * T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.
 * Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
 * Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

"Penryn", "Penryn-3M" (medium-voltage, 45 nm) <span class="anchor" id="&quot;Penryn&quot; (medium-voltage, 45 nm)"> <span class="anchor" id="&quot;Penryn-3M&quot; (medium-voltage, 45 nm)">

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),  Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 * Select Apple subsets of P7000 series processors support Intel VT-x.
 * Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
 * Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
 * Package size: 35 mm × 35 mm
 * Transistors: 410 million
 * Steppings: (Core microarchitecture 45nm steppings)
 * C0, E0 (Penryn)
 * M0, R0 (Penryn-3M)
 * stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
 * stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 * Die size: 107 mm2
 * Package size: 22 mm × 22 mm
 * Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 * Die size: 107 mm2
 * Package size: 22 mm × 22 mm
 * Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
 * Die size: 107 mm2
 * Package size: 22 mm × 22 mm
 * Steppings: M0, R0

"Penryn XE" (45 nm) <span class="anchor" id="&quot;Penryn XE&quot; (standard-voltage, 45 nm)">

 * These models feature an unlocked clock multiplier
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
 * Die size: 107 mm2
 * Steppings: C0, E0

"Penryn QC" (45 nm) <span class="anchor" id="&quot;Penryn QC&quot; (standard-voltage, 45 nm)">

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
 * Die size: 2 × 107 mm2
 * Steppings: E0

"Penryn QC XE" (45 nm) <span class="anchor" id="&quot;Penryn QC XE&quot; (standard-voltage, 45 nm)">

 * This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 * Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
 * Package size: 35 mm × 35 mm
 * Die size: 2 × 107 mm2
 * Steppings: E0

Clarksfield<span class="anchor" id="&quot;Clarksfield&quot; (45 nm)">
Common features:
 * Socket: G1.
 * All the CPUs support dual-channel DDR3-1333 RAM.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 45 nm.
 * XM-suffix processors have an unlocked multiplier and can be overclocked.

Arrandale<span class="anchor" id="&quot;Arrandale&quot; (MCP, 32 nm)">
Common features:
 * Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
 * All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.

Core i (2nd gen)
==== Sandy Bridge-M<span class="anchor" id="&quot;Sandy Bridge&quot; (32 nm)"> <span class="anchor" id="&quot;Sandy Bridge-M&quot; (dual-core, 32 nm)"> <span class="anchor" id="&quot;Sandy Bridge-M&quot; (quad-core) (32 nm)"> <span class="anchor" id="&quot;Sandy Bridge&quot; (32 nm)_2"> ====

Common features:
 * Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
 * All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.
 * XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (3rd gen)
==== Ivy Bridge<span class="anchor" id="&quot;Ivy Bridge&quot; (22 nm)"> <span class="anchor" id="&quot;Ivy Bridge-M&quot; (dual-core, 22 nm)"> <span class="anchor" id="&quot;Ivy Bridge-M&quot; (quad-core) (22 nm)"> <span class="anchor" id="&quot;Ivy Bridge&quot; (22 nm)_2"> ====

Common features:
 * Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
 * All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (4th gen)
==== Haswell-MB<span class="anchor" id="&quot;Haswell-MB&quot; (22 nm)"> <span class="anchor" id="&quot;Haswell-MB&quot; (dual-core, 22 nm)"> <span class="anchor" id="&quot;Haswell-MB&quot; (quad-core, 22 nm)"> ====

Common features:
 * Socket: G3.
 * All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.
 * MX-suffix models have an unlocked multiplier and can be overclocked.

Haswell-ULT<span class="anchor" id="&quot;Haswell-ULT&quot; (SiP, 22 nm)"> <span class="anchor" id="&quot;Haswell-ULT&quot; (SiP, dual-core, 22 nm)">
Common features:
 * Socket: BGA 1168.
 * All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.

Haswell-ULX<span class="anchor" id="&quot;Haswell-ULX&quot; (SiP, 22 nm)"> <span class="anchor" id="&quot;Haswell-ULX&quot; (SiP, dual-core, 22 nm)">
Common features:
 * Socket: BGA 1168.
 * All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 12 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.

==== Haswell-H<span class="anchor" id="&quot;Haswell-H&quot; (dual-core, 22 nm)"> <span class="anchor" id="&quot;Haswell-H&quot; (MCP, quad-core, 22 nm)"> <span class="anchor" id="&quot;Haswell-H&quot; (MCP, quad-core, (22 nm) 2"> ====

Common features:
 * Socket: BGA 1364.
 * All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 22 nm.
 * i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Broadwell-U<span class="anchor" id="&quot;Broadwell-U&quot; (14 nm)"> <span class="anchor" id="&quot;Broadwell-U&quot; (dual-core, 14 nm)">
Common features:
 * Socket: BGA 1168.
 * All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
 * All CPU models provide 12 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

==== Broadwell-H<span class="anchor" id="&quot;Broadwell-H&quot; (dual-core, 14 nm)"> <span class="anchor" id="&quot;Broadwell-H&quot; (MCP, quad-core, 14 nm)"> <span class="anchor" id="&quot;Broadwell-H&quot; (MCP, quad-core, 14 nm) 2"> ====

Common features:
 * Socket: BGA 1364.
 * All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 14 nm.

Broadwell-Y<span class="anchor" id="&quot;Broadwell-Y&quot; (SoC, dual-core, 14 nm)">
Common features:
 * Socket: BGA 1234.
 * All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 12 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Skylake-U<span class="anchor" id="&quot;Skylake-U&quot; (14 nm)"> <span class="anchor" id="&quot;Skylake-U&quot; (dual-core, 14 nm)">
Common features:
 * Socket: BGA 1356.
 * All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

==== Skylake-H<span class="anchor" id="&quot;Skylake-H&quot; (14 nm)"> <span class="anchor" id="&quot;Skylake-H&quot; (quad-core, 14 nm)"> <span class="anchor" id="&quot;Skylake-H&quot; (MCP, quad-core, 14 nm)"> <span class="anchor" id="&quot;Skylake-H&quot; (MCP, quad-core, 14 nm) 2"> ====

Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Skylake-Y<span class="anchor" id="&quot;Skylake-Y&quot; (SoC, dual-core, 14 nm)">
Common features:
 * Socket: BGA 1515.
 * All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake-U<span class="anchor" id="&quot;Kaby Lake-U&quot; (14 nm)"> <span class="anchor" id="&quot;Kaby Lake-U&quot; (dual-core, 14 nm)">
Common features:
 * Socket: BGA 1356.
 * All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake-H<span class="anchor" id="&quot;Kaby Lake-H&quot; (14 nm)"> <span class="anchor" id="&quot;Kaby Lake-H&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Kaby Lake-Y<span class="anchor" id="&quot;Kaby Lake-Y&quot; (dual-core, 14 nm)">
Common features:
 * Socket: BGA 1515.
 * All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake-Y<span class="anchor" id="&quot;Kaby Lake-Y&quot; (SoC, dual-core, 14 nm)">
Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:
 * Socket: BGA 1515.
 * All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Coffee Lake-U<span class="anchor" id="&quot;Coffee Lake-U&quot; (dual-core, 14 nm)"> <span class="anchor" id="&quot;Coffee Lake-U&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1528.
 * All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

==== Coffee Lake-H<span class="anchor" id="&quot;Coffee Lake-H&quot; (quad-core, 14 nm)"> <span class="anchor" id="&quot;Coffee Lake-H&quot; (hexa-core, 14 nm)"> <span class="anchor" id="Coffee Lake-H (14 nm, 8th/9th generation)"> ====

Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Coffee Lake-B<span class="anchor" id="&quot;Coffee Lake-B&quot; (quad-core, 14 nm)"> <span class="anchor" id="&quot;Coffee Lake-B&quot; (hexa-core, 14 nm)">
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2666 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake Refresh<span class="anchor" id="&quot;Kaby Lake Refresh&quot; (14 nm)"> <span class="anchor" id="&quot;Kaby Lake Refresh&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1356.
 * All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
 * All CPU models provide 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake-G<span class="anchor" id="&quot;Kaby Lake-G&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 2270.
 * All the CPUs support dual-channel DDR4-2400 RAM.
 * All CPU models provide 8 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Amber Lake-Y<span class="anchor" id="&quot;Amber Lake-Y&quot; (dual-core, 14 nm)">
Common features:
 * Socket: BGA 1515.
 * All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Whiskey Lake-U<span class="anchor" id="&quot;Whiskey Lake-U&quot; (dual-core, 14 nm)"> <span class="anchor" id="&quot;Whiskey Lake-U&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1528.
 * All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Cannon Lake-U<span class="anchor" id="&quot;Cannon Lake-U&quot; (dual-core, 10 nm)">
Common features:
 * Socket: BGA 1528.
 * All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 10 nm.

Amber Lake-Y
Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:
 * Socket: BGA 1515.
 * All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Coffee Lake-H (refresh)
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Core i (10th gen)
==== Comet Lake-U<span class="anchor" id="&quot;Comet Lake-U&quot; (dual-core, 14 nm)"> <span class="anchor" id="&quot;Comet Lake-U&quot; (quad-core, 14 nm)"> <span class="anchor" id="&quot;Comet Lake-U&quot; (14 nm)"> ====

Common features:
 * Socket: BGA 1528.
 * All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

==== Comet Lake-H<span class="anchor" id="&quot;Comet Lake-H&quot; (quad-core, 14 nm)"> <span class="anchor" id="&quot;Comet Lake-H&quot; (14 nm)"> <span class="anchor" id="Comet Lake-H (14 nm, 10th generation)"> ====

Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Ice Lake-U<span class="anchor" id="&quot;Ice Lake-U&quot; (dual-core, 10 nm)"> <span class="anchor" id="&quot;Ice Lake-U&quot; (quad-core, 10 nm)">
Common features:
 * Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
 * All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
 * PCIe 3.0 support.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 512 KB per core.
 * Fabrication process: 10 nm.

Ice Lake-Y<span class="anchor" id="&quot;Ice Lake-Y&quot; (dual-core, 10 nm)"> <span class="anchor" id="&quot;Ice Lake-Y&quot; (quad-core, 10 nm)">
Common features:
 * Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
 * All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
 * PCIe 3.0 support.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 512 KB per core.
 * Fabrication process: 10 nm.

Amber Lake-Y (10xxx)<span class="anchor" id="&quot;Amber Lake-Y&quot; (quad-core, 14 nm)">
Common features:
 * Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
 * All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
 * All CPU models provide 10 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Tiger Lake-UP3<span class="anchor" id="&quot;Tiger Lake-UP3&quot; (10 nm SuperFin)">
Common features:
 * Socket: BGA 1449.
 * All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
 * All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-UP4<span class="anchor" id="&quot;Tiger Lake-UP4&quot; (10 nm SuperFin)">
Common features:
 * Socket: BGA 1598.
 * All the CPUs support dual-channel LPDDR4X-4266 RAM.
 * All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-H<span class="anchor" id="&quot;Tiger Lake-H&quot; (10 nm SuperFin)">
Common features:
 * Socket: BGA 1598.
 * All the CPUs support dual-channel DDR4-3200 RAM.
 * All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Tiger Lake-H35<span class="anchor" id="&quot;Tiger Lake-H35&quot; (10 nm SuperFin)">
Common features:
 * Socket: BGA 1449.
 * All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
 * PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Alder Lake-U<span class="anchor" id="&quot;Alder Lake-U&quot; (Intel 7)">
Common features:
 * Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
 * All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
 * ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Alder Lake-P<span class="anchor" id="&quot;Alder Lake-P&quot; (Intel 7)">
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * The following models are available with IPU (infrastructure processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Alder Lake-H<span class="anchor" id="&quot;Alder Lake-H&quot; (Intel 7)">
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
 * All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Alder Lake-HX<span class="anchor" id="&quot;Alder Lake-HX&quot; (Intel 7)">
Common features:
 * Socket: BGA 1964.
 * All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
 * All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * The i9 models have unlocked multipliers, allowing them to be overclocked.

Alder Lake-N<span class="anchor" id="&quot;Alder Lake-N&quot; (Intel 7)">
These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:
 * Socket: BGA 1264.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
 * All CPU models provide 9 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache: 2 MB per cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-U<span class="anchor" id="&quot;Raptor Lake-U&quot; (Intel 7)">
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * The i3-1315U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-P<span class="anchor" id="&quot;Raptor Lake-P&quot; (Intel 7)">
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-H<span class="anchor" id="&quot;Raptor Lake-H&quot; (Intel 7)">
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
 * The i5-13500H is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-PX<span class="anchor" id="&quot;Raptor Lake-PX&quot; (Intel 7)">
Common features:
 * Socket: BGA 1792.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-HX<span class="anchor" id="&quot;Raptor Lake-HX&quot; (Intel 7)">
Common features:
 * Socket: BGA 1964.
 * All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * All models support CPU, iGPU, and memory overclocking.
 * i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Raptor Lake-HX Refresh
Common features:
 * Socket: BGA 1964.
 * All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
 * All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * All models support CPU, iGPU, and memory overclocking.
 * i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Raptor Lake-U Refresh
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * Includes integrated graphics based on Xe-LP architecture.
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * The Core 3 100U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Meteor Lake-U
Common features:
 * Socket: BGA 2049.
 * All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
 * All CPU models provide 20 lanes of PCIe 4.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * Includes integrated graphics based on Alchemist architecture.
 * L1 cache:
 * P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
 * Fabrication process: Intel 4 (compute tile).
 * Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Meteor Lake-H
Common features:
 * Socket: BGA 2049.
 * All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
 * All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * Includes integrated graphics based on Alchemist architecture.
 * L1 cache:
 * P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
 * Fabrication process: Intel 4 (compute tile).
 * Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Arrandale
Common features:
 * Socket: BGA 1288.
 * All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.

Sandy Bridge-DT
The following models from the Sandy Bridge desktop range are available as embedded processors:
 * Core i7-2600
 * Core i5-2400
 * Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M
Common features:
 * Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
 * All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.

Gladden<span class="anchor" id="&quot;Gladden&quot; (32 nm)">
Common features:
 * Socket: BGA 1284.
 * All the CPUs support dual-channel DDR3-1333 RAM.
 * All CPU models provide 16 lanes of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.

Ivy Bridge-DT
The following models from the Ivy Bridge desktop range are available as embedded processors:
 * Core i7-3770
 * Core i5-3550S
 * Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M
Common features:
 * Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
 * All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
 * i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 32 nm.

Gladden<span class="anchor" id="&quot;Gladden&quot; (22 nm)">
Common features:
 * Socket: BGA 1284.
 * All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
 * All CPU models provide 20 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * No integrated graphics.
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.

Haswell-DT
Common features:
 * Socket: LGA 1150.
 * All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 22 nm.

The following models from the Haswell-DT desktop range are also available as embedded processors:
 * Core i7-4790S
 * Core i7-4770S
 * Core i5-4590S
 * Core i5-4590T
 * Core i5-4570S
 * Core i3-4360
 * Core i3-4350T
 * Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H<span class="anchor" id="&quot;Haswell-H&quot; (22 nm)">
Common features:
 * Socket: BGA 1364.
 * All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 22 nm.

Broadwell-H
Common features:
 * Socket: BGA 1364.
 * All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 14 nm.

Skylake-S
Common features:
 * Socket: LGA 1151.
 * All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Skylake-H
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 * Fabrication process: 14 nm.

Kaby Lake-S
Common features:
 * Socket: LGA 1151.
 * All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Kaby Lake-H
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2400 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Whiskey Lake-U
Common features:
 * Socket: BGA 1528.
 * All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Coffee Lake-R
Common features:
 * Socket: LGA 1151-2.
 * All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Coffee Lake-H (refresh)
Common features:
 * Socket: BGA 1440.
 * All the CPUs support dual-channel DDR4-2666 RAM.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.

Comet Lake-S
Common features:
 * Socket: LGA 1200.
 * All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
 * All CPU models provide 16 lanes of PCIe 3.0.
 * All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
 * L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 * L2 cache: 256 KB per core.
 * Fabrication process: 14 nm.
 * i9-10900E features Thermal Velocity Boost.

Tiger Lake-UP3
Common features:
 * Socket: BGA 1449.
 * All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
 * All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
 * -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.

Tiger Lake-H
Common features:
 * Socket: BGA 1598.
 * All the CPUs support dual-channel DDR4-3200 RAM.
 * All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 * L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 * L2 cache: 1.25 MB per core.
 * Fabrication process: 10 nm.
 * The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
 * Minimum operating temperature: 0°C.

Alder Lake-S
Common features:
 * Socket: LGA 1700.
 * All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
 * All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * Turbo Boost version is 2.0.

Alder Lake-U
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Alder Lake-P
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Alder Lake-PS<span class="anchor" id="&quot;Alder Lake-PS&quot; (Intel 7)">
Common features:
 * Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
 * All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Alder Lake-H
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
 * All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 1.25 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-S
Common features:
 * Socket: LGA 1700.
 * All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
 * All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
 * E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
 * Fabrication process: Intel 7.
 * Turbo Boost version is 2.0.

Raptor Lake-U
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-P
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Raptor Lake-H
Common features:
 * Socket: BGA 1744.
 * All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
 * All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * L1 cache:
 * P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
 * Fabrication process: Intel 7.

Meteor Lake-PS
Common features:
 * Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
 * All the CPUs support dual-channel DDR5-5600 RAM.
 * All CPU models provide 20 lanes of PCIe 4.0.
 * All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 * Includes integrated graphics based on Alchemist architecture.
 * L1 cache:
 * P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
 * E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 * L2 cache:
 * P-cores: 2 MB per core.
 * E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
 * All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
 * Fabrication process: Intel 4 (compute tile).
 * Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.