List of Intel Pentium processors

The Intel Pentium brand was a line of mainstream x86-architecture microprocessors from Intel. Processors branded Pentium Processor with MMX Technology (and referred to as Pentium MMX for brevity) are also listed here. It was replaced by the Intel Processor brand in 2023.

"P5" (800 nm)

 * Based on P5
 * Steppings: B1, C1, D1 (Note: D1 stepping processors do not have FDIV bug)

"P54C" (600 nm)

 * Based on P5 microarchitecture
 * Steppings: B1, B3, B5, C2, E0 (Note: D1 stepping processors do not have FDIV bug)

"P54CQS" (350 nm)

 * Based on P5 microarchitecture

"P54CS" (350 nm)

 * Based on P5 microarchitecture

"P55C" (350 nm)

 * Based on P5 microarchitecture

P6 based Pentiums
Desktop processors based on the P6 microarchitecture were marketed as Pentium Pro, Pentium II and Pentium III, as well as variations of these names.

NetBurst based Pentiums
Desktop processors based on the NetBurst microarchitecture were marketed as Pentium 4 and Pentium D.

Core based Pentiums
Earlier E5xxx desktop processors based on the Core microarchitecture were marketed as Pentium Dual-Core, while later E5xxx and all E6xxx models were named Pentium. Note however, that several resellers will still refer to the newer generation processors as Pentium Dual-Core.

"Allendale", "Conroe" (65 nm)
The Intel Pentium Dual-Core processors, E2140, E2160, E2180, E2200, and E2220 use the Allendale core, which includes 2 MB of native L2 cache, with half disabled leaving only 1 MB. This compares to the higher end Conroe core which features 4 MB L2 Cache natively. Intel has shifted its product lines having the Core 2 line as Mainstream/Performance, Pentium Dual-Core as Mainstream, and the new Celeron (based on the Conroe-L core) as Budget/Value.


 * Based on the 64-bit Core microarchitecture.
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation)
 * Die size: 77 mm² (Allendale-1M), 111 mm² (Allendale), 143 mm² (Conroe)
 * Steppings: L2, M0 (Allendale), G0 (Conroe)

"Wolfdale-3M" (45 nm)
The E5000 series and E6000 series use the same 45 nm Wolfdale-3M core as the E7000 series Core 2s, which has 3 MB L2 cache natively. 1 MB of L2 cache is disabled, for a total of 2 MB L2 cache, or twice the amount in the original Allendale Pentiums. The Wolfdale core is capable of SSE4, but it is disabled in these Pentiums. Pentium E2210 is an OEM processor based on Wolfdale-3M with only 1 MB L2 cache enabled out of the total 3 MB.


 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation)
 * Die size: 82 mm²
 * Steppings: R0
 * Based on the Penryn microarchitecture
 * Part of 3MB L2 Cache Disabled
 * E2210 is a Wolfdale-3M with 2MB cache disabled unlike all other E22xx, which are Allendale.
 * E5000-series processors were initially known as Pentium Dual-Core, while all later processors were just Pentium.
 * E6500K has unlocked multiplier, and is only available in China as limited edition.
 * Models with a part number ending in "ML" support Intel VT-x.

"Clarkdale" (MCP, 32 nm)

 * Note that these are also dual core, but under the Pentium brand.
 * Based on Westmere microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Contains 45 nm "Ironlake" GPU.
 * G6951 can be unlocked to enable Hyper-threading and an extra 1MB of L3 cache, which are present in the CPU but deliberately disabled, with the purchase of a $50 upgrade card by way of the Intel Upgrade Service.

"Sandy Bridge" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Pentium G8xx supports DDR3-1333 in addition to DDR3-1066.
 * HD Graphics (Sandy Bridge) contain 6 EUs as well as HD Graphics 2000, but does not support the following technologies: Intel Quick Sync Video, InTru3D, Intel Clear Video HD, Wireless display, Intel insider.
 * Transistors: 504 million
 * Die size: 131 mm²
 * The Pentium G622, once upgraded via Intel Upgrade Service, operates at 3.2 GHz, has 3 MB L3 cache and is recognized as Pentium G693.
 * The Pentium G632, once upgraded via Intel Upgrade Service, operates at 3.3 GHz, has 3 MB L3 cache and is recognized as Pentium G694.

"Ivy Bridge" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * G20xx support up to DDR3-1333 memory while G21xx support up to DDR3-1600.
 * HD Graphics (Ivy Bridge) contain 6 EUs as well as HD Graphics 2500, but does not support the following technologies: Intel Quick Sync Video, InTru3D, Intel Clear Video HD, Wireless display, Intel insider.

"Haswell-DT" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * G32xx support up to DDR3-1333 memory while G34xx support up to DDR3-1600.
 * G3258 (Pentium anniversary edition) has unlocked CPU multiplier.
 * Haswell Pentiums support Quick Sync Video.
 * Transistors: 1.4 billion
 * Die size: 177mm²

"Bay Trail-D" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, Intel VT-x.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.0 and OpenCL 1.1 (on Windows). J2900 supports Intel Quick Sync Video.
 * Package size: 25 mm × 27 mm

"Braswell" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Broadwell Intel HD Graphics, with 18 execution units, and supports DirectX 11.2, OpenGL 4.4, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 27 mm

"Skylake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache.
 * All models support up to DDR3-1600 or DDR4-2133 memory.
 * Embedded models support ECC memory.
 * Transistors: TBD
 * Package size: 37.5 mm x 37.5mm

"Apollo Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI. TXT/TXE
 * Package size: 24 mm × 31 mm
 * DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB
 * Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
 * Integrated Intel HD Graphics (Gen9) GPU
 * PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
 * Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
 * Two USB 2.0 ports
 * Two SATA-600 ports (one multiplexed with USB 3.0)
 * Integrated HD audio controller
 * Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
 * Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
 * Serial I/O supporting SPI, HSUART (serial port) and I2C

"Gemini Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SGX.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 18 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 24 mm

"Gemini Lake Refresh" (14 nm)
50
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SGX.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 18 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 2.0 (on Windows).
 * Package size: 25 mm × 24 mm

"Kaby Lake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, ECC memory.
 * All models support up to DDR3-1600 or DDR4-2400 memory.
 * Low power models also support configurable TDP (cTDP) down.
 * Transistors: TBD
 * Package size: 37.5 mm x 37.5mm

"Coffee Lake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, ECC memory.
 * All models support up to DDR4-2400 memory.
 * Low power models also support configurable TDP (cTDP) down.
 * Transistors: TBD
 * Package size: 37.5 mm x 37.5mm

"Comet Lake-S" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
 * All models support up to DDR4-2666 memory.
 * Low power models also support configurable TDP (cTDP) down.
 * Transistors: TBD
 * Package size: 37.5 mm x 37.5mm

"Alder Lake" (Intel 7)

 * All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, DL Boost, GNA 3.0, and Optane memory.
 * All models support up to DDR5-4800 or DDR4-3200 memory, and 16 lanes of PCI Express 5.0 + 4 lanes of PCIe 4.0.

"P54C" (600 nm)

 * Based on P5 microarchitecture

"P54LM" (350 nm)

 * Based on P5 microarchitecture

"P55LM" (350 nm)

 * Based on P5 microarchitecture

"Tillamook" (250 nm)

 * Based on P5 microarchitecture

P6 based Pentiums
Mobile processors based on the P6 microarchitecture were marketed as Pentium II, Pentium III, Pentium M and Pentium Dual-Core, as well as variations of these names.

NetBurst based Pentiums
Mobile processors based on the NetBurst microarchitecture were marketed as Pentium 4.

Core based Pentiums
Prior mobile processors based on the Core microarchitecture were marketed as Pentium Dual-Core, while the current models are named Pentium. Note however, that several resellers will still refer to them as Pentium Dual-Core.

"Yonah" (65 nm)

 * Based on the 32-bit Enhanced Pentium M microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation)
 * Die size: 90.3 mm²
 * Steppings: D0
 * T2060 debuted on January 30, 2007 in notebooks only sold as part of Windows Vista launch bundles; it appears to be OEM-only.
 * T2060 & T2080 were discovered to be an Intel Core T2050 & T2250 with half the L2 cache (old versions of CPU-Z identified them as T2050 & T2250)

"Merom-M", "Merom-2M" (65 nm)

 * Based on the 64-bit Core microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation)
 * Die size: 111 mm²
 * Steppings: M0

"Penryn-3M", "Penryn-L" (45 nm)

 * Based on the 64-bit Penryn microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation)
 * Die size: 82 mm²
 * Steppings: R0

Note: The Pentium SU2X00 series processors have a single core, not two, according to Intel's website.

"Arrandale" (MCP, 32 nm)

 * Based on Westmere microarchitecture
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Smart Cache
 * FSB has been replaced with DMI.
 * Contains 45 nm "Ironlake" GPU HD Graphics.
 * Die size: 81 mm²
 * Transistors: 382 million
 * Graphics and Integrated Memory Controller die size: 114 mm²
 * Transistors: 177 million
 * Stepping: C2, K0

"Sandy Bridge" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Smart Cache.
 * HD Graphics (Sandy Bridge) contain 6 EUs as well as HD Graphics 2000, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, Intel Insider.
 * Transistors: 504 million
 * Die size: 131 mm²

"Ivy Bridge" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * HD Graphics (Ivy Bridge) contain 6 EUs as well as HD Graphics 2500, but does not support the following technologies: Intel Quick Sync Video, InTru 3D, Clear Video HD, Wireless Display, Intel Insider.
 * Transistors: 1.4 billion
 * Die size: 160 mm²

"Haswell-MB" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * Transistors: 1.3 billion
 * Die size: 181 mm²

"Haswell-ULT" (SiP, 22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * 3558U also supports Intel Wireless Display.
 * Transistors: 1.3 billion
 * Die size: 181 mm²

"Haswell-ULX" (SiP, 22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache.
 * 3561Y also supports Intel Wireless Display.
 * Transistors: 1.3 billion
 * Die size: 181 mm²

"Broadwell-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Smart Cache, Intel Wireless Display, and configurable TDP (cTDP) down
 * 3825U also supports Hyper-threading.
 * Transistors: 1.3 billion
 * Die size: 82 mm²

"Bay Trail-M" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Ivy Bridge Intel HD Graphics, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.0 and OpenCL 1.1 (on Windows). N3530 and N3540 support Intel Quick Sync Video.
 * Package size: 25 mm × 27 mm
 * Transistors: 960 million
 * Die size: 130 mm²

"Braswell" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Broadwell Intel HD Graphics, with 16 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 27 mm

"Skylake-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, Intel Wireless Display, and configurable TDP (cTDP) down
 * GPU supports DirectX 12, OpenGL 4.4 and Intel Quick Sync Video.

"Skylake-Y" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, Intel Wireless Display, and configurable TDP (cTDP) down
 * GPU supports DirectX 12, OpenGL 4.4 and Intel Quick Sync Video.

"Apollo Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Skylake Intel HD Graphics, with 18 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0, OpenCL 1.2 (on Windows) and Intel Quick Sync Video.
 * Package size: 24 mm × 31 mm

"Gemini Lake" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SGX.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 18 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 24 mm

"Gemini Lake Refresh" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SGX.
 * GPU and memory controller are integrated onto the processor die
 * GPU is based on Kaby Lake Intel HD Graphics, with 18 execution units, and supports DirectX 12, OpenGL 4.5, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
 * Package size: 25 mm × 24 mm

"Kaby Lake-U" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

Note: Pentium 4415U was renamed to Pentium Gold 4415U (end 2017).

"Kaby Lake-Y" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

"Kaby Lake Refresh" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

"Amber Lake-Y" (14 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SGX, MPX, Hyper-threading, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache, and configurable TDP (cTDP) down.
 * Pentium Gold 6500Y also support: AVX, AVX2, FMA3, Turbo Boost, and configurable TDP (cTDP) up.

"Tiger Lake-UP3" (10 nm SuperFin)

 * All models support: SSE4.1, SSE4.2, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4.

"Jasper Lake" (10 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Intel SHA Extensions, MBEC, SMAP/SMEP
 * Package size: 35 mm x 24 mm
 * DDR4/LPDDR4 dual-channel memory controller supporting up to 16 GB
 * Display controller with 1 MIPI DSI 1.2 port and 3 DDI ports (eDP 1.4b, MIPI DSI 1.2, DP 1.4a, or HDMI 2.0b)
 * Integrated Intel HD Graphics (Gen11) GPU
 * PCI Express 3.0 controller supporting 8 lanes (multiplexed); 4 lanes available externally
 * Two USB 3.2 2x1 ports (a.k.a. USB 3.1)
 * Four USB 3.2 1x1 ports (a.k.a. USB 3.0)
 * Eight USB 2.0 ports
 * Two SATA-600 ports
 * Integrated HD audio controller
 * Integrated image signal processor supporting four cameras (three concurrent)
 * Integrated memory card reader supporting SDIO 3.0 and eMMC 5.1
 * Serial I/O supporting SPI, HSUART (serial port) and I2C
 * Integrated CNVi with Wi-Fi 6 (IEEE 802.11ax 1x1 and 2x2) and Bluetooth 5.x (using UART/I2S/USB2)

"Alder Lake-U" (Intel 7)

 * All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, IPU6 (except SRLFV), TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 * Support 20 lanes (UP3) or 14 lanes (UP4) of PCI Express 4.0/3.0.
 * All models support up to LPDDR5-5200 or LPDDR4X-4266 memory
 * Standard power models also support up to DDR5-4800 or DDR4-3200 memory.

"Sandy Bridge" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Smart Cache, Hyper-threading.
 * No models include HD Graphics.
 * Transistors: 624 or 504 million
 * Die size: 149 or 131 mm2

"Sandy Bridge-EN" (32 nm)

 * Based on Sandy Bridge-E CPU.
 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel VT-d, AES-NI, Smart Cache.

"Ivy Bridge-EN" (22 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, AES-NI, Smart Cache.
 * Support for up to 6 DIMMS of DDR3 memory.

"Broadwell-DE" (14 nm, SoC)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, AES-NI, Smart Cache, ECC memory.
 * D1508, D1517, D1519 also support Hyper-threading, Turbo Boost.
 * SoC peripherals include 8 × USB (4 × 2.0, 4 × 3.0), 6 × SATA, 2 × Integrated 10 GbE LAN, UART, GPIO, and 32 lanes of PCI Express (8 × 2.0, 24 × 3.0), in ×16, ×8 and ×4 configurations.
 * Support for up to four DIMMs of DDR4 or DDR3L memory per CPU socket.

"Gladden" (32 nm)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, EPT, Hyper-threading, Smart Cache, ECC memory.
 * Transistors:
 * Die size:

"Elkhart Lake" (10 nm SuperFin)

 * All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
 * GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI.
 * SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
 * Package size: 35 mm × 24 mm